Orbotech has completed the acquisition of SPTS Technologies Group which works in the areas of advanced packaging and micro-electro-mechanical systems (MEMS).
The company said that the acquisition of SPTS would help them as the latter is a capital equipment supplier to the semiconductor industry. It supplies etch, deposition and thermal processing solutions to the advanced packaging and MEMS markets.
Speaking about the company's decision to buy SPTS, Gordon said: "SPTS has long been a recognized leader and vendor-of-choice in these high-growth markets, and like Orbotech, is an integral player in the electronics manufacturing ecosystem. Through this strategic acquisition, we are able to expand our product portfolio into these arenas and extend our operation into adjacent segments including RF and power chips. We are excited to begin working on new developments with SPTS and providing customers with the added benefits of the joining of our two companies."
Following the acquisition, both the companies will be showcasing three of their systems which have been designed to meet the needs of the advanced packaging industry at SEMICON Taiwan.
Orbotech's laser direct imaging (LDI) solution for cost-effective maskless patterning, a CAM-guided digital jet printer and a high-speed precision UV laser drilling system will also be displayed.
Kevin Crofton, corporate vice president and president of SPTS said, "SPTS will be showcasing their new Rapier XE DRIE module which was launched in May. For via reveal and TSV etching, the Rapier XE etches 100% exposed Si 2 to 3 times faster than the competition, and is the only DRIE module capable of endpointing the Cu via tips as they emerge from the Si surface.
"With the ReVia endpoint, users can choose to use tip heights as small as 1 μm and save costs from reduced passivation thickness, and shorter polishing times. Combined with our range of stress engineered low temperature oxide and nitrides, SPTS has a compelling solution for 2.5 and 3D wafer backside processing."
