Taiwan Semiconductor Manufacturing Co.(TSMC)and Kinsus Interconnect Technology Co.,Ltd.would become the primary winners of Apple's added contracts for iPhone 5 chips,according to industry sources.
Apple's supply chains have reportedly been asked to supply components sufficient enough for 60 million iPhone 5s in harmony with Apple's revised goal,far more than Apple's original request for inventories enough for 40 million phones.
They said Apple adds the inventories in preparation for the upcoming Christmas shopping season.
Requested by Apple,chip vendors supplying iPhone 5 chips have increased contracts to silicon foundries,IC assemblers and package substrate suppliers.
Based on past routines,TSMC was contracted to build Qualcomm's 3G/4G LTE baseband chips incorporating power management ICs,Broadcom's Wi-Fi wireless combo chips,Dialog's A6 power management ICs,Cirrus Logic's voice chips and part of Texas Instruments'touch-screen and analog chips.All these suppliers are iPhone component suppliers.
Industry executives estimate for each iPhone 5 sold TSMC would receive US$12-15 for its revenue.
Kinsus is already contracted to supply flip-chip chip-scale packaging(FC CSP)for approximately 50%of Apple A5X chips.The company has secured almost all of the packaging substrates contracts for logic ICs used in iPhone 5.Industry executives estimated each sold iPhone 5 would contribute the company US$7-8 in revenue.
