Rudolph Technologies has unveiled new patented Clearfind technology, developed for an advanced packaging inspection.
The company intends to integrate technology in its upcoming defect inspection systems for packaging applications.
The technology is capable of identifying organic defects that are difficult or impossible to determine with conventional white-light imaging techniques.
Organic contaminants are primarily responsible for field failures, which occur after the material has been exposed to operating conditions for extended periods.
The technology is said to highlight organic residues on bumps and bond pads or at the bottoms of vias, allowing in easy detection.
It will eradicate the high-contrast graininess on metals, which can be observed under conventional illumination.
According to the company, the Clearfind technology readily detects shorts and opens in metal lines when inspected with an underlying organic layer.
Rudolph process control group general manager and vice president Mike Goodrich said: “As advanced packaging processes become more complex, process windows are shrinking and manufacturers are seeking better methods for control and inspection that balance the need for high throughput against the ‘escape’ of true defects and the ‘false positive’ detection of nuisance defects.
“Organic defects, in particular, have become more troublesome as die interconnects shrink and there is less surface area for good adhesion.
“Clearfind technology will help our customers see these defects earlier in the process, permitting faster action to mitigate the root cause and reducing the amount of product in jeopardy.”
