Global embedded processing solutions provider Freescale Semiconductor has shipped 175 million RF power transistors in plastic packages.
According to the US-based company, over-molded plastic packaging can withstand the high heat levels generated by RF power transistors and maintain the optimal performance level.
Freescale Semiconductor senior vice president and general manager Ritu Favre said the company continues to set the pace in plastic package performance, temperature ratings as well as volume production.
"Shipping more than 175 million RF power devices in plastic packages underscores the broad market acceptance of Freescale's innovative plastic packaging technology," Favre said.
Source:
http://householdelectronicsproducts.packaging-business-review.com/news/freescale-ships-power-transistors-in-plastic-packages-120313
