Trade Resources Industry Views MACOM Announces Volume Shipments Of PMD Chip-Set For 100G SR-4 QSFP Modules

MACOM Announces Volume Shipments Of PMD Chip-Set For 100G SR-4 QSFP Modules

Tags: M/A-COM, QSFP28

M/A-COM Technology Solutions Inc of Lowell, MA, USA (which makes semiconductors, components and subassemblies for analog RF, microwave, millimeter-wave and photonic applications) has announced the availability of volume shipments of its physical media device (PMD) chip-set for 100Gbps short-reach SR-4 applications. The chip-set includes the MALD-37045, a four-channel 25.78G/28.05G VCSEL driver, and the MATA-37044, a transimpedance amplifier (TIA)/limiting amplifier, both with integrated clock & data recovery (CDR) functionality. The devices offer ultra-low power consumption, making them suitable for small-form-factor applications, says MACOM.

The integrated CDR functionality provides improved jitter performance and lower power compared with discrete chip-sets. Targeted for QSFP module applications, the devices feature direct, DC-coupled wire-bonding to vertical-cavity surface-emitting lasers (VCSELs) and photodetectors. Together, the devices offer a complete one-stop solution for 100Gbps QSFP optical modules, active optical cables (AOCs) and on-board optical engines for Ethernet and InfiniBand applications.

"The MALD-37045 and MATA-37044 extend MACOM's leading portfolio of CDRs, laser drivers and TIAs to support short-reach applications," says Marek Tlalka, direct of product marketing, High-Performance Analog.

"The industry-leading high integration, small chip-size and low power of MACOM's VCSEL driver chipset make it an ideal solution for 100Gbps connectivity in high-volume data-center and high-performance computing applications," comments Infinity Huang, head of R&D at China-based Hisense Broadband Multimedia Technologies Co Ltd, whch is one of the first companies to ship volume quantities of 100G optical QSFP connectivity products based on MACOM's new chip-set.

The MALD-37045 and MATA-37044 are on display in booth #3101 at the Optical Fiber Communication Conference & Exposition (OFC 2016) in Anaheim, CA, USA (22-24 March).  

 

Source: http://www.semiconductor-today.com/news_items/2016/mar/macom_170316.shtml
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