Dow Packaging and Specialty Plastics, along with Nordmeccanica, has introduced a new lamination technology, developed by using both adhesive and machinery hardware advancements.
The companies have used Dow's new Symbiex solventless adhesives ultra-fast curing adhesive technology and Nordmeccanica's Duplex SL One Shot lamination line to develop the new lamination technology.
The new technology will enable to form a package in less than one day from lamination, in addition to achieving food compliance within one day for most film structures
It also allows to check bond quality within 30 minutes after lamination, as well reduces adhesive scrap.
Duplex SL One Shot features a unique system that will handle the solventless lamination process, allowing the two adhesive components to come into contact as late as possible in the lamination process.
Two independent high-precision coating stations will make the two films to press together only in the lamination nip station where the curing of the adhesive takes place.
Dow Adhesives packaging, textiles and hygiene global business director Greg Bunker said: "We are excited to launch this breakthrough technology at Drupa, just 18 months after the signing of the joint development agreement with Nordmeccanica."
Nordmeccanica Group technology vice president Vincenzo Cerciello said: "With Symbiex and the Duplex SL One Shot laminator, we are able to slit just 90 minutes after lamination compared to today's 24 hour standard. This is an exciting development and game changing innovation for the lamination adhesives market."
