TSMC and Imagination Technologies are working together to develop reference design flows and silicon implementations for Imagination’s PowerVR Series6 GPUs on TSMC’s advanced process technologies, including 16nm FinFET process technology.
Imagination and TSMC are investigating how the characteristics of the latest processes, such as 16FinFET, influence the design of high performance IP-based SoCs.
"Just as memory drove silicon processes in the ‘80s and ‘90s, and CPUs drove processes further in the late ‘90s and ‘00s, high performance mobile GPUs for graphics and compute applications are one of the major drivers for our most advanced process technologies," said Dr. Cliff Hou, TSMC vice president, R&D.
3D chips
The companies will also develop reference system designs incorporating high bandwidth memory standards and TSMC’s 3D IC technology for integrating into mobile SoCs.
"Many of our licensees rely on TSMC to provide them with leading edge low power, high performance silicon foundry capabilities. Through advanced projects initiated under this partnership, Imagination and TSMC are working together to showcase how SoCs will transform the future of mobile and embedded products," said Hossein Yassaie, CEO of Imagination.
