India’s flexible packaging firm Uflex has developed a new pouch for Whole Foods Market's tortilla chips.
Uflex engineers have designed a three-layered, including 12.5μ coated polyster, 18μ BOPP, 35μ polyethylene, packaging structure as a 3D flat bottom pouch.
Polyester will act as a better barrier for oxygen, in addition to exhibiting good thermal resistance for melting temperatures between 150°C and 160°C.
BOPP serves as a strong barrier to moisture, while polyethylene acts as a sealant layer and provides strength and sturdiness to the pouch.
Special registered matte coating was applied on the glossy polyester to provide a paper like organic look for the pouch.
The same machine can be used to carry out registered top coating either in matte or gloss to provide transparent window for the pouch. It can also be reverse printed.
A concealed press-to-close (PTC) pocket zipper on the front panel of the 3D pouch with a perforated strip will enable to easily open and protect the product from deferred use.
According to the company, the 3D pouch renders a 360 degree branding canvas to the pack as it has five distinct panels.
Uflex managing director and chairman Ashok Chaturvedi said: “You will be glad to know that the pouch has been fabricated on a special Quad Seal Machine with a registered PTC/ Slider applicator and perforation facility.
“This machine has also been indigenously manufactured by our Engineering Business at the Noida Plant.”
