U.S. 8,632,857 B2
Valspar Sourcing Inc. has been awarded a patent for a method of coating a metal substrate with a hardenable packaging coating system comprised of applying an under-coat composition to a metal substrate, the under-coat composition contains a polyester (co)polymer, and a phenolic cross-linker; applying an over-coat composition to the under-coated metal substrate, the over-coat composition is comprised of a PVC organosol containing a poly(vinyl chloride) (co)polymer dispersed in a substantially nonaqueous over-coat carrier liquid, wherein the over-coat composition includes finely divided poly(vinyl chloride) co(polymer) particles that exhibit a volume average particle diameter from approximately 0.5 to 30 micrometers; and curing the under-coat and over-coat compositions in combined or separate cure st EPS to provide a hardened film on the metal substrate that includes the under-coat and over-coat compositions, wherein the under-coat composition can optionally be at least partially cured prior to application of the over-coat composition; wherein the under-coat and over-coat compositions are substantially free of mobile BPA, BPF, BADGE and BFDGE.
