UBM Canon has expanded its educational events aimed at the packaging field with new and improved seminars being held February, 2013. The WestPack Seminars will run concurrently with the WestPack exhibition.
Building on the success in 2012, these seminars are a series of practical educational sessions focused on the latest technologies and process improvement techniques to help packaging professionals gather information trends in packaging as well as the implementable solutions to top packaging challenges. The WestPack Seminars are led by leading OEMs, industry experts and top innovators. Experts deliver practical sessions designed in a bite-sized, modular format to maximize the tradeshow experience.
Attendees can pick and choose from six expert-led seminars:
Sustainability and Materials
3D Printing Solutions for Packaging
Smart Packaging
Robotics in Packaging
Innovations in Labeling and Decorating
Traceability and Serialization
Lisa McTigue Pierce, executive editor of Packaging Digest, a UBM Canon brand, says, "With these seminars, we've honed in on some of the hottest topics in packaging today. They are broad enough to appeal to a wide audience yet will also share proven solutions for specific markets and functions within the packaging discipline."
The seminars take place over three days, from Feb. 12 to 13, 2013.
