LED packaging house Edison Opto has said it will issue 5-year zero-interest unsecured convertible bonds totaling NT$1 billion (US$33.3 million) to fund capacity expansion for high-power LED and PLCC (plastic leaded chip carrier) components.
Edison is expanding capacity to meet strong growth in LED lighting demand from China-based makers, Chinese-language newspaper Economic Daily News (EDN) cited company CEO Jason Wu as indicating.
At its factory in eastern China, Edison will expand monthly PLCC packaging capacity from 50-70 million LED chips currently to 150 million and monthly high-power LED packaging capacity from 10-12 million units to 20 million, EDN said.
Edison will also expand monthly COB (chip on board) packaging capacity from 500,000 chips to 1.5 million and monthly PLCC packaging capacity from 70-80 million units to 150 million in Taiwan, EDN indicated.
