Kulicke & Soffa said it will participate at SEMICON West trade show, which is being held in San Francisco, California.
The company will give a video illustration of its lithography solution, developed for advanced packaging at the trade show. Besides this, the company is also planning to showcase several of its packaging solutions.
Kulicke & Soffa will demonstrate Asterion EV, which has been built on an extended architecture of large frame for applications including battery interconnect wire bonding, dual lane material handling systems and large power modules.
IConn ProCu PLUS, is a machine that can handle copper bonding requirement, the ProCu5 is claimed to be offering high level of copper process capability with many added controls and improvements enabling robust wire bonding production for node wafers at scales of 28 nanometers or below.
The company will showcase its hybrid wafer feeder, which enables combination of ultra-high speed passive and accurate flip-chip bonding directly from wafer, tape and reel or waffle pack.
This is claimed to be ideal for high volume system-in-package, flip-chip, die-attach and wafer-level packaging manufacturing with placement accuracy up to 7µm at 3 sigma.
Kulicke & Soffa Lithography Business Lines vice president Gerrit van der Beek said: “We are excited to share with customers our first step-and-repeat lithography solution serving the broad-ranging requirements of the Advanced Packaging market. The high-throughput, modular i-line steppers uniquely utilize a laser-light source, driving best-in-class cost-of-ownership.”
Recently, the company acquired Dutch firm Liteq, which offers lithography solutions for advanced packaging of microchips. Financial details about the acquisition were not disclosed.
