Researchers based in the USA and France have created graphene nanoribbon structures with regions that have relatively large energy bandgaps of about 0.5eV [J. Hicks et al, Nature Physics, published online 18 November 2012]. Flat graphene ...
Tags: silicon carbide, graphene, nanoribbon structures, bandgaps, energy bands
The transaction is expected to close in the first half of 2013 Dutch chipmaker ASML has agreed to acquire the US based Cymer for €1.95bn to accelerate the development of extreme ultraviolet (EUV) semiconductor lithography technology. ...
Tags: ASML, extreme ultraviolet, semiconductor lithography, smartphones, tablets
The acquisition will boost ASML's development work on the next generation of chipmaking technology Intel will invest around $4.1bn to buy 15% of Dutch semiconductor equipment provider ASML, to help fund its research into new chip ...
Tags: Intel, semiconductor equipment, ASML, Dutch chipmaker
TSMC will invest €838m to acquire 5% in ASML Taiwan Semiconductor Manufacturing Company (TSMC) has signed an agreement with Dutch firm ASML to invest €1.1bn in the latter's Customer Co-Investment Program that aims to develop new ...
Tags: extreme ultraviolet, TSMC, ASML, new chip, semiconductor
US-based food packaging and labeling firm Precision Press plans to set up a new Goss Sunday Vpak web offset printing system for flexible packaging applications at the 213,000ft2 North Mankato facility by the end of 2012. The new ...
EV Group has completed its expanded cleanroom IV facility at its corporate headquarters in Austria, which doubled its cleanroom space for process development and pilot production services. As part of the company's long-term growth ...
Tags: EV Group, R&D facilities, wafer bonding equipment, lithography equipment
EV Group (EVG) a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced the completion of its newly expanded cleanroom IV facility at its corporate headquarters in ...
Tags: EV Group, light emitting diodes, LEDs
EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography equipment for the MEMS (micro-electro-mechanical system), nanotechnology and semiconductor markets, has completed its newly expanded cleanroom IV facility. ...
Tags: EVG, MEMS, semiconductor
Mainz,November 27,2012–The SCHOTT technology group has developed a nanostructuring technique for surfaces that already ranks among the important emerging technologies:so-called nanoimprint lithography.This technological platform ...
Tags: SCHOTT, nanoimprint lithography, specialty glasses and materials, glass
Taipei, Oct. 29, 2012 (CENS)--Taiwan Semiconductor Manufacturing Co. (TSMC) on Oct. 23 bought for over NT$3.2 billion (US$106 million) 14.32 hectares of land at the Jhunan Park, an extension of the Hsinchu Science Park in northern Taiwan, ...
Tags: TSMC, Taiwan Semiconductor Manufacturing Co., chip, Intel, Samsung
Computerworld-There will be a sea change in the non-volatile memory(NVM)market over the next five years,with more dense and reliable technologies challenging dominant NAND flash memory now used in solid-state drives(SSD)and embedded in ...
Tags: Non-Volatile Memory, software, flash memory, SSD
Flash-based solid-state devices(SSDs)are making headway in the datacentre,especially for read-intensive applications requiring high performance,but will continue to take second place for write-intensive applications,including many"big ...
Tags: FlashBased SSDs, making headway in the datacentre, Scott Dietzen
Strategies United predicts that by 2015 the global market for high brightness LEDs (HB-LEDs) will generate revenues of $18.9 billion, representing a compound growth rate of 11.8%. A key factor in the growth of HB-LEDs is the use of ...
Tags: LED
Optical waveguide connects semiconductor chips 04 Oct 2012 Technique suits high-performance emitter-receiver systems for optical data transmission. KITted out:The novel optical wire bond is adapted to the position and orientation of ...
EV Group(EVG)of St Florian,Austria,a supplier of wafer bonding and lithography equipment for the MEMS(micro-electro-mechanical system),nanotechnology and semiconductor markets,has received an order for its EVG850 temporary ...