Universal Robots, a Danish manufacturer of smaller flexible industrial collaborative robot arms, said it will showcase its new scalable packaging solutions at this month’s PACK EXPO 2017 in Las Vegas to address the rapid-changing ...
Tags: Packaging, PACK EXPO 2017
In booth #159 at the European Conference on Optical Communications (ECOC 2017) in Gothenburg, Sweden (18-20 September), optical and photonic optical component and subsystem maker Lumentum Holdings Inc of Milpitas, CA, USA is highlighting ...
South Korean LED maker Seoul Semiconductor Co Ltd has filed a lawsuit, together with its affiliate Seoul Viosys Co Ltd, in the US District Court for the Central District of California asserting that Archipelago Lighting Inc is selling ...
Tags: LED bulb, LED packaging
SAKATA INX and its subsidiary INX International Ink are exhibiting narrow web label, sleeve and flexible packaging ink products, UV, EB and low migration inks and coatings and digital printing technologies, at Labelexpo Europe to be held in ...
The Small Form Factor Pluggable Double Density (SFP-DD) Multi Source Agreement (MSA) Group has completed the initial hardware specification and drawings for the SFP-DD pluggable interface designed to enable high-speed, high-density ...
Tags: pluggable interface, hardware
Kaiam Corp of Newark, CA, UA (which makes optical transceivers for hyperscale data centers) has announced general availability of the XQX5000-series of QSFP28 100G-CWDM4 transceivers based on its LightScale2 platform. The product is ...
Tags: optical transceivers, packaging
MACOM Technology Solutions Inc of Lowell, MA, USA (which makes semiconductors, components and subassemblies for analog RF, microwave, millimeter-wave and photonic applications) is showcasing its portfolio of optoelectronics and photonic ...
Tags: semiconductors, components
Tokyo-based Showa Denko K.K. (SDK) has decided to expand its facilities for producing high-quality-grade silicon carbide (SiC) epitaxial wafers for power devices - which have already been marketed under the trade name High-Grade Epi (HGE) - ...
Tags: SiC power devices, semiconductors
Linx Printing Technologies has appointed a second distributor in Pakistan to help meet demand for its extensive range of equipment in key markets such as snacks, meat, foods, pharmaceuticals, personal care and cables. Scalesmen Weighing ...
Tags: Linx, Linx Printing
Enjoy Life Foods has announced a complete packaging makeover for its entire product portfolio featuring the unofficial shade of food allergy awareness, bright teal. The first to debut Enjoy Life’s bold new look are new Grain & Seed ...
Tags: Enjoy Life Foods, Seed Bars
Multifunctional digital imaging systems manufacturer Konica Minolta Business Solutions (Canada) has launched the New AccurioPress C6100 / C6085 series of full colour digital production presses. The technology integrates high-volume ...
Food firm Tulip, part of the Danish Crown group, has acquired UK pig producer Easey. Easey Holdings Ltd is a family-owned pig farming operation consisting of four key divisions – breeding herds(sows), growing herds, a veterinary ...
Tags: Food firm Tulip, Tulip Agriculture
AXT Inc of Fremont, CA, USA - which makes gallium arsenide (GaAs), indium phosphide (InP) and germanium (Ge) substrates and raw materials – has completed the purchase of its new manufacturing facility in the city of Dingxing, China. ...
Tags: gallium arsenide, indium phosphide
Packaging products supplier Crown Holdings has unveiled plans to construct a new beverage can plant in Spain. The new facility will be developed in the Valencia region for the manufacturing of aluminum beverage cans. Crown has selected ...
Tags: Packaging products, Beverage Can
Weiler Labeling Systems (WLS) will exhibit its LC-100 label coder and LP-100 label printer at the Healthcare Packaging Expo, which is due to be held on 25th -27th September in Las Vegas. The company, which was acquired by Pro Mach in May ...