Teledyne Scientific & Imaging and test instrument maker Teledyne LeCroy of of Chestnut Ridge, NY, USA (a subsidiary of Teledyne Technologies Inc) say that researchers at the Microwave Electronics Lab at Chalmers University of Technology in ...
Tags: Wireless Transmission, Electronics
Tokyo-based Mitsubishi Electric Corp has launched its large hybrid silicon carbide (SiC) transfer-mold dual in-line package intelligent power module (DIPIPM), which incorporates a SiC Schottky barrier diode (SBD) and seventh-generation IGBT ...
Tags: hybrid silicon carbide, dual in-line package intelligent power module
Dana Holding Corporation announced today the introduction of a new aluminum cooling technology for electric and hybrid vehicles. Specifically, the company is utilizing the efficiency of aluminum in its Long® brand of integrated ...
Broadband wireless and wireline communications component maker Anadigics Inc of Warren, NJ, USA has launched a new product family of voltage-controlled oscillators (VCOs), beginning with the AMV8901 (7.3-8.2GHz), AMV8902 (7.8-8.8GHz), ...
Tags: Anadigics VCOs, Wireless Backhaul
The next-generation power semiconductor market will increase at a compound annual growth rate (CAGR) of 63% between 2011 and 2017 to more than $500m, forecasts market research firm The Information Network in its report 'Next-Generation ...
Tags: Power Semiconductor, Electronics
Cree Inc of Durham, NC, USA has released what it claims is the first all-SiC (silicon carbide) 1.7kV power module in an industry-standard 62mm housing. Powered by Cree's C2M large-area SiC chip technology, the new half-bridge module ...
Freescale Semiconductor of Austin, TX, USA, which provides RF power transistors for cellular markets, has launched what is claimed to be the first 2W integrated power amplifier (PA) operating with a 5V supply and delivering more than 40dB ...
Tags: Freescale InGaP HBT, Electrical, Electronics
Tokyo-based Mitsubishi Electric Corp has launched a railcar traction inverter system for 1500VDC catenaries that incorporates what is claimed to be the first all-silicon carbide (SiC) power modules made with SiC transistors and SiC diodes. ...
Tags: Mitsubishi Electric SiC power modules SiC, Electrical, Electronics
Sonoscan has shipped the first of its new D9600Z C-SAM systems. This new model is designed expressly to facilitate the imaging of IGBT (Insulated Gate Bipolar Transistor) power modules. Power modules, such as IGBTs, are basically ...
Tags: C-Sam System, Power Modules
RF front-end component maker and foundry services provider TriQuint Semiconductor Inc of Hillsboro, OR, USA has introduced its first integrated power amplifier solution for small-cell and active antenna base-stations, dramatically reducing ...
Tags: TriQuint, Small-Cell Power
After giving a trading update for first-half 2013 in late July, epiwafer foundry and substrate maker IQE plc of Cardiff, Wales, UK has confirmed record revenue of £63m (up 84% from £34.3m for first-half 2012). EBITDA (earnings ...
Tags: IQE, Electrical, electronics
The market for semiconductors used in industrial electronics applications relished a better-than-expected first quarter as macroeconomic headwinds turned out to be less severe than initially feared, according to the latest Industrial ...
Tags: Electrical, Electronics, semiconductors
In a trading update for first-half 201, epiwafer foundry and substrate maker IQE plc of Cardiff, Wales, UK says it expects first-half performance to be ahead of market expectations, with revenue approaching £63m, EBITDA (earnings ...
Tags: IQE, Electrical
IBM has introduced the fifth generation of its semiconductor technology specialized for high-performance communications. The firm’s latest silicon-germanium (SiGe) chip-making process is designed to enable increasing amounts of data ...
Tags: IBM, SiGe Tektronix
Pure-play compound semiconductor wafer foundry Global Communication Semiconductors LLC (GCS) of Torrance, CA, USA says that its proprietary indium gallium phosphide (InGaP) heterojunction bipolar transistor (HBT) D5 and P7 foundry processes ...
Tags: GCS, HBT Foundry Processes