Chipmakers including Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics (UMC) and Micron Technology have been informed by their upstream suppliers that prices for 12-inch blank silicon wafers will rise by up to 20% ...
Tags: Blank Wafers, Semiconductor
Toyota Motor has developed the world's first method for observing the behavior of lithium ions (Li-ions) in an electrolyte when a Li-ion battery charges and discharges. By using this method, it is possible to observe in real-time, the ...
Tags: Toyota Motor, Lithium Ions
Axon, powered by Pro Mach, introduces three new shrink sleeve and tamper evident machines and a compact energy efficient steam tunnel at Pack Expo in Chicago, 6-9 November. Each new machine delivers performance, reliability, flexibility, ...
Tags: Axon, Shrink Sleeve Applicators
India’s flexible packaging materials and solution company Uflex has developed 9.5 micron specialty ALOx polyester film, Flexaloxprotcettm F-PGX. Said to be the thinnest PET ALOx specialty film available globally, Flexaloxprotcettm ...
Tags: Packaging, Alox Polyester Film
Aluminium cans recycler Novelis has confirmed that the UPM Raflatac’s 23 micron Vanish label film is sufficiently light and does not affect the quality of recycled aluminum. The ultra-thin Vanish PET label film, which is proved to ...
Imec and Ghent University in Belgium have used aspect ratio trapping (ART) techniques to produce indium gallium arsenide (InGaAs) multiple quantum wells (MQWs) on 300mm-diameter silicon in a ridge format that could be used in future laser ...
Tags: InGaAs MQWs, InGaAs Laser diodes, Imec and Ghent University
Yale University and University of Illinois Urbana in the USA have improved the efficiency of gallium arsenide phosphide (GaAsP) solar cells on silicon (Si) by reducing threading dislocation densities (TDDs) [Kevin Nay Yaung et al, Appl. ...
Tags: GaAsP solar cells, GaAsP, MBE, MOCVD
At the 18th International Conference on Crystal Growth and Epitaxy (ICCGE-18) in Nagoya, Japan (7-12 August), analytical and imaging instrument maker Nanophoton Corp of Osaka, Japan has introduced the RAMANdrive wafer analyzer for a wide ...
With the re-grouping of teams from III-V Lab (the joint Alcatel-Lucent, Thales and CEA-Leti industrial research laboratory), Almae Technologies SAS is taking over III-V Lab's facilities at Marcoussis, which is sited on the Plateau de Saclay ...
Tags: CEA-Leti, III-V Lab, laser components
Micro-assembly equipment maker Finetech of Berlin, Germany says that a Lambda bonding system has been installed in the Lurie Nanofabrication Facility (LNF) at the University of Michigan in Ann Arbor. The sub-micron accuracy bonder is ...
Tags: LED, packaging equipment
Xeikon, an innovator in digital color printingtechnology, will unveil its newly developed Flatbed die-cut unit, the XeikonFDU at drupa 2016, Messe Düsseldorf, 31 May to 10 June. Developed to aid efficient end-to-end printing ...
Tags: Xeikon, Didital color printing technology, Flatbed die-cut unit, Drupa
Clondalkin Flexible Packaging, a producer of shrink sleeves, die cut lids and lidding foils, launches an ultra-thin shrink sleeve. The Switzerland based company (former Nyco Flexible Packaging) reports breakthrough developments in down ...
The universities of Virginia and of Texas in the USA have been developing avalanche photodiodes (APDs) based on aluminium indium arsenide antimonide (AlInAsSb) alloys. Two papers from the group detail the implementation of a staircase ...
Three-dimensional televisions are not successful because their 3D images do not meet people's expectations. Viewers have to wear 3D glasses, and visual fatigue prevents long-duration viewing. An ideal 3D display technique that overcomes ...
Tags: Micromirrors, 1D Scanning, Display
In booth 2223 (Hall C) at SPIE Photonics West 2016 in San Francisco (16-18 February), engineered materials and optoelectronic component maker II-VI Inc of Saxonburg, PA, USA is presenting a broad portfolio of products from several of its ...
Tags: Laser Modules, Photonics West