OPEL Technologies Inc of Toronto, Ontario, Canada – which develops III-V semiconductor devices and processes through US affiliate OPEL Defense Integrated Systems (ODIS Inc) of Storrs, CT – says that it has achieved Milestone 4 ...
Tags: OPEL, semiconductor devices, semiconductor
Fabless semiconductor firm Nujira Ltd of Cambridge, UK has released details of test results that demonstrate how its envelope tracking (ET) technology can unlocks the potential of RF CMOS power amplifiers (PAs) for high-end 3G and 4G ...
A 3D spintronics IC built at Cambridge University could increase chip density by 1000 times. The technique uses an electron’s spin to store data. This is the first time a spintronics device has been built in 3D. The chip is built ...
Tags: 3D spintronics IC, electron, data storing
Epistar,the Taiwan-based company that is ranked as one of the world's largest manufacturers of high-brightness LEDs,has become the latest major producer to hint at a transfer to a potentially much cheaper silicon platform. Currently the ...
Epistar hints at'game-changing'silicon LED switch 12 Oct 2012 Giant Taiwanese LED maker works with GaN-on-silicon specialist Azzurro on technology with potential to cut cost of solid-state lighting. Plessey's GaN-on-silicon LED ...
Tags: LED, Taiwan, technology, manufacture
Demonstration of functional components brings Si photonics closer to CMOS standards. imec results announced at Semicon West Imec has successfully demonstrated the creation of functional sub-100 nm photonics components on 300 mm silicon ...
Tags: Imec, OpSIS, Silicon photonics, Silicon West, CMOS, Optics
ULIS to triple IR sensor capacity 11 Jul 2012 Investment of €20 million and move to 200mm wafers as the firm marks its tenth anniversary. ULIS 200mm CMOS wafer ULIS,the France-based manufacturer of uncooled infrared sensors for ...
Tags: ULIS, wafer, silicon CMOS process, infrared sensors
Fabless semiconductor firm Black Sand Technologies Inc of Austin,TX,USA has been selected to provide its silicon power amplifier(PA)technology for integrated RF front-end products made by Murata Manufacturing Co Ltd.The products will be ...
Tags: Black Sand, semiconductor, 3G smartphones, BST34 Series devices
III-V Lab(formed in 2004 as a privately held Paris-based joint venture between telecoms-focused Alcatel-Lucent Bell Labs France and defense&aerospace-focused Thales Research and Technology)has reported results of its activities for the ...
Tags: CEA-Leti, III-V Lab, Partnership