Food processing firm Archer Daniels Midland (ADM) is realigning business segments to further accelerate growth. The company announced the realignment of its business segments across four units – Carbohydrate Solutions, Nutrition, ...
Tags: Food processing
Epson America, a provider of digital label and packaging solutions, is set to exhibit its commercial label printing solutions at the Natural Products Expo West event in Anaheim, California, US. The event will take place from 7 March to 11 ...
Tags: digital label, packaging
Danish Crown’s Polish meat business Sokolow has revealed its intentions to acquire its rival Gzella Meat Group. Gzella Meat's operations are confined to the northern region of Poland. The deal between the two Polish meat firms ...
Tags: Polish meat, Gzella Meat
Unilever is calling the consumer goods industry to accelerate action to tackle ocean packaging waste and create a circular economy for plastics. Last year, the firm has announced its commitment to make its plastic packaging 100% reusable, ...
Tags: Unilever, consumer goods industry
Flint Group has increased the prices of its packaging inks products due to incremental cost escalation forces. Further to announcements made in March 2017, it has become clear that the raw material markets for many components within Flint ...
Tags: Flint Group, Packaging Inks
During its 2017 Analyst Day at its Series 6 factory in Perrysburg, Ohio, First Solar Inc of Tempe, AZ, USA – which makes cadmium telluride (CdTe)-based thin-film photovoltaic modules as well as providing engineering, procurement & ...
Tags: First Solar, photovoltaic modules
Covestro is committed to continually improving the performance and safety of its products and setting new standards in industrial hygiene. Responsible handling of chemical substances has always been necessary for avoiding health risks. ...
Tags: Covestro, Adhesive Raw Materials
ROHM of Kyoto, Japan is to provide full-SiC (silicon carbide) power modules to the VENTURI Formula E team during season 4 (2017–2018) of FIA Formula E (the world’s first formula racing championship for all-electric vehicles), ...
Tags: Power Modules, silicon carbide
Amazon introduced “Frustration-Free Packaging,” an invention designed to reduce waste and delight customers with easy-to-open, 100% recyclable packaging, ten years ago this holiday season. Frustration-Free Packaging ends ...
ClassOne Technology of Kalispell, MT, USA (which manufactures Solstice electroplating systems for ≤200mm wafers), has unveiled a new plating technique that is said to provide significant cost reductions for compound semiconductor ...
Tags: Compound Semiconductors
For fiscal first-quarter 2018 (to end-September 2017), optical and photonic optical component and subsystem maker Lumentum Holdings Inc of Milpitas, CA, USA has reported revenue of $243.2m, down 5.8% on $258.1m a year ago due to softer ...
Tags: optical component, subsystem
FUJIFILM North America Corporation, Graphic Systems Division announces it will be increasing the prices of its offset printing plates. The price increase is a result of raw material cost increases, most significantly driven by substantial ...
Smurfit Kappa Group (SKG) has reported revenue of €2.12bn for the third quarter of 2017, representing a growth of 4% compared to the same period last year. For the full year that ended 30 September 2017, the company reported revenue ...
Tags: Smurfit Kappa Group, packaging
Spain-based paper mill company Europac Group has increased its net profit by 81.8% to £58.2m for the first nine months of the year compared to the same period last year. The company made a turnover of €876.9m in the reported ...
Tags: Europac, paper mill
Toshiba Electronic Devices & Storage Corp (TDSC) - spun off from Toshiba Corp in July - has enhanced its diode portfolio with the addition of six Schottky barrier diodes (SBDs) fabricated with silicon carbide (SiC) and housed in ...
Tags: Toshiba, Schottky Barrier, Package