The collaboration will combine ARM's next-generation mobile processor and POP IP with GLOBALFOUNDRIES 28nm-SLP HKMG process application. Globalfoundries has unveiled the new POP technology offerings to optimise the ARM Cortex-A12 and ...
Tags: Globalfoundries, Mobile Processors, ARM
Fab equipment spending will grow two percent year-over-year (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast. Fab construction spending, which can be a ...
Tags: Fab Equipment, 2014
The seesaw mobile processor battle between ARM and Intel continued at Computex, with ARM claiming it offered better performance per watt for mobile devices than Intel's upcoming chips. ARM's processors go into most smartphones and ...
As Intel mulls a plan to expand its contract-manufacturing operations, the company has lost ground as the world's top semiconductor company to chip suppliers benefitting from the success of mobile devices, according to a study by IC ...
After a vetting process that lasted a little more than six months, Intel has named Brian Krzanich as its next CEO, succeeding Paul Otellini, who will officially hand over the reins of the chip giant at the company's annual stockholders' ...
Tags: Intel, Brian Krzanich
The worldwide capital equipment market fell 15% last year to $36.9bn from $43.5 billion in 2011, says SEMI. SEMI expects a flat to single-digit decline trend this year and a strong recovery in 2014. ...
Tags: Capex Flat, capital equipment
Increased spending in NAND and flash by Micron, LEDs by Philips and Osram, and continued investments by GLOBALFOUNDRIES will create new opportunities for equipment and materials suppliers in Southeast Asia. These trends will be explored at ...
Tags: Electrical, Electronics, semiconductor
GlobalFoundries has showcased a new technology that allows 3D stacking of chips for use in mobile and consumer applications. The company uses the 20nm-LPM process technology to manufacture its first functional 20nm silicon wafers with ...
Tags: mobile, applications, chips
It's no secret that Samsung is up against Apple in many ways, in products, sales and innovation. However, even in the face of Apple's patent infringement lawsuits, Samsung is still climbing the charts. The electronics giant sold ...
Tags: Samsung, Consumer Electronics, apple
Globalfoundries claims a breakthrough in 3D stacking of chips with the demonstration of functional 20nm silicon wafers with integrated through-silicon vias. The technique allows chips to be stacked on top of each other with circuit ...
Tags: Consumer Electronics, Electronics, Chip
Dynamic changes to R&D processes, tools, technical challenges, and funding/business models will be highlighted at SEMICON West 2013, along with product displays of the latest semiconductor manufacturing technology, components and ...
Seven O-S-D product categories and device groups reached record-high sales in 2012 compared to 14 new records being set in 2011, according to data shown in the 2013 edition of IC Insights’ O-S-D Report, A Market Analysis and Forecast ...
Tags: opto sensor, Optoelectronics, sensor
By Christian Gregor Dieseldorff, director, SEMI Industry Research & Statistics, San Jose, CA USA Despite difficult times, growing demand for mobile devices (such as tablets and phones) inspires an improved outlook for chip sales in ...
Tags: 2013, Fab Equipment, Spending
Fab equipment spending for Front End facilities is expected to be flat in 2013, remaining around $31.7 billion, increasing to $39.3 billion in 2014 — a 24% increase. The SEMI World Fab Forecast also reveals that in 2013 increases for ...
Tags: Electrical, Electronics, LED
Samsung was by far the 300mm capacity leader in 2012 having about 61% more 300mm capacity than second-place SK Hynix, says IC Insights. Intel was the only other company that held a double-digit share of 300mm capacity at the end of 2012. ...
Tags: capacity leader, electronics, market share