Toshiba is offering European ASIC customers a flexible process development and foundry manufacturing service built around its 8"(200mm)CMOS wafer fabrication capabilities. The service combines support for special processes,process ...
Tags: Electrical, Electronics, Lights, Lighting
4 September 2012 EV Group launches next-generation EVG150 automated resist processing platform for compound semiconductors,MEMS,and advanced packaging EV Group(EVG)of St Florian,Austria,a supplier of wafer bonding and lithography ...
Tags: EV Group, MEMS, spray coating technology
Cadence is working with foundry TSMC on a tool chain and process for 3D chip designs. 3D chip design incorporates multi-chip packages and even multi-die devices with through silicon via(TSV)interconnect technologies.This requires that the ...
Tags: TSMC and Cadence, 3D Chips, intellectual property, through silicon via