Avago Technologies has announced its new active optical cable (AOC) family, high-density SFP+ QSFP+ and CXP solutions for high-performance computing (HPC) and data-center applications. The firm says that the active optical cable assemblies ...
Tags: Avago, AOC, Avago Technologies, cable, optical cable assemblies
BASF Coatings and the design agency Are We Designer are joint winners of the "red dot award: communication design" for the design of their global automotive color trend book. The red dot award is a worldwide design awards. More than ...
Tags: BASF Coatings, red dot award, Berlin
USA - PLASA Focus: Stamford 2012 grows from strength to strength as new exhibitors and new seminar speakers join the party. PLASA Focus: Stamford will be the first regional PLASA event for the Tri-state area and takes place just 30 minutes ...
Tags: USA, exhibition, Stamford 2012
Big Blue joins up with five Russian businesses to create a new Electronics Technology Center to be housed at the Skolkovo Innovation City IBM and five Russian companies, Skolkovo Foundation, Rusnano, Rostelecom, Russian Venture ...
Advanced Design Technology announces that its TURBOdesign Suite version 5.2 is now shipping.This version of the company's three-dimensional(3D)inverse design technology software provides a new TURBOdesign Volute module and faster ...
Tags: Advanced Design Technology, TURBOdesign Suite, 3D, customized solutions
Unisource Global Solutions (UGS) a division of the US-based Unisource Worldwide has completed the asset acquisition of Pakit, a developer of molded fiber solutions for the packaging industry, for an undisclosed amount. Unisource Worldwide ...
Mitsubishi Electric has developed a prototype electric vehicle (EV) motor system with an incorporated silicon carbide inverter. The company claims that the EV motor system is the smallest of its kind, measuring half the dimensions of the ...
The fall months bring many new changes,the turning of leaves,an introduction to 3 intense months of holidays,harvest time and the occasional harvest moon.And although folk lore and celebrations have occured for what seems like an endless ...
Tags: fall celebration, HongKong, Mid-Autumn Festival, Victoria Park
Advanced Design Technology announced the results of its 2012 Pump Design Survey, which set out to identify opportunities for using 3D inverse design technology in pump designs. In response to the survey results, ADT has launched its ...
Tags: Industrial Equipment&Components, ADT, 3D inverse design technology
Joerg Strughold,v-p of EMEA sales at Atmel tells Electronics Weekly industrial applications continue to be largest end market,followed by smartphones and tablets in the consumer market Describe your company's business in two sentences. ...
Tags: EMEA, RF, technology, application
STMicroelectronics'strategy of being a'competitive follower'in process technology means that the advantage in gaining access to processing equipment gained by the Intel,Samsung,TSMC lithographic alliance with ASML will not affect ST. "We ...
Tags: STMicroelectronics, processing equipment, EUV machines, FD-SOI technology
ARM and Cadence have produced the first in a series of combined products for ARM’s POPs (processor optimisation packs). POPs have core-hardening acceleration technologies from ARM’s physical IP division. In the Cadence/ARM ...
Tags: Lights, Lighting, POPs, processor optimisation packs
Facebook has taken delivery of the first set of innovative server racks it helped design, technology that the company hopes other organizations with large data centers will adopt. The prototype racks represent some of the ...
Tags: Facebook, Social Media, USA, server racks
22 June 2012 Fujitsu develops first high-output,single-chip 10GHz transceiver using GaN HEMT At the IEEE MTT-S International Microwave Symposium(IMS 2012)in Montreal,Canada(17-21 June),Fujitsu Laboratories of Kawasaki,Japan presented what ...
Cadence is working with foundry TSMC on a tool chain and process for 3D chip designs. 3D chip design incorporates multi-chip packages and even multi-die devices with through silicon via(TSV)interconnect technologies.This requires that the ...
Tags: TSMC and Cadence, 3D Chips, intellectual property, through silicon via