Tokyo-based Showa Denko K.K. (SDK) has decided to expand its facilities for producing high-quality-grade silicon carbide (SiC) epitaxial wafers for power devices - which have already been marketed under the trade name High-Grade Epi (HGE) - ...
Tags: SiC power devices, semiconductors
Berlin Packaging, the supplier of plastic, glass, and metal containers and closures, has announced the launch of a newly-designed website for Dangerous Goods, its division that has been helping companies safely and economically ship ...
Tags: Berlin Packaging, Packaging
Rudolph Technologies will launch its new Truebump technology on the Dragonfly inspection system at SEMICON Taiwan, which is due to be held from 13 to 15 September 2017. The new Truebump technology delivers quick, accurate and repeatable ...
Tags: Rudolph, Semicon Taiwan 2017
Evatec Ltd of Trübbach, Switzerland (which makes thin-film deposition and etch processing equipment for advanced packaging, power device, MEMS, optoelectronics, wireless communication and photonics applications) is setting up its own ...
Tags: Evatec, advanced packaging
As part of the Special Session program at the IEEE Energy Conversion Congress & Expo (ECCE 2017) in Cincinnati, OH (1–5 October), the Power Electronics Industry Collaborative (PEIC) – a national, industry-focused member-based ...
Tags: semiconductor, supply chain
Packaging solutions provider CSP Technologies is expanding its Auburn manufacturing facility in Alabama, US for increased manufacturing and warehousing space. The manufacturing and warehousing capacity of the facility is being expanded by ...
Tags: Packaging, warehousing space
SPTS Technologies Ltd of Newport, Wales, UK (an Orbotech company that manufactures etch, PVD and CVD wafer processing solutions for the MEMS, advanced packaging, LED, high-speed RF on GaAs, and power management device markets) has won a ...
ULMA Packaging has launched the patent-pending VTI640V vertical form fill and seal system (VFFS), a new packaging solution for herbs and leaf produce. The product will be pulled to the bottom of the bag, by the solution using a device, ...
Tags: ULMA Packaging, Packaging
Atomic layer deposition (ALD) thin-film technology firm Picosun Oy of Espoo, Finland has reported repeat sales of automated P-300BV vacuum batch production systems to major Asian discrete device manufacturers. Even if the 300mm wafer size ...
Tags: LED lighting, MEMS
Skyworks Solutions Inc of Woburn, MA, USA (which manufactures analog and mixed-signal semiconductors) has launched the SKY66403-11, its newest 2.4GHz fully integrated RF front-end module (FEM), designed to support ZigBee, Thread and ...
Tags: Skyworks, Front-End Module
Packaging materials developer Tekni-Plex has started production at its new manufacturing facility in Suzhou, China. The new advanced facility, which features 140,000ft² of space, has already began producing products for the ...
Ferrotec (USA) Corp, the US subsidiary of materials, component and precision system supplier Ferrotec Holdings Corp of Santa Clara, CA, USA (whose Temescal division of Livermore, CA, USA makes electron-beam evaporative coating systems) has ...
Tags: Ferrotec, operate valve
The US Department of Energy’s Advanced Research Projects Agency-Energy (ARPA-E) has announced $30m in funding for 21 projects as part of the CIRCUITS program (‘Creating Innovative and Reliable Circuits Using Inventive Topologies ...
Tags: WBG devices, electronics devices
Skyworks Solutions Inc of Woburn, MA, USA (which manufactures analog and mixed-signal semiconductors) has added the SKY12239-11 voltage-controlled variable attenuator (VVA) to its series of broadband, flat-attenuation, high-IIP3 ...
Tags: semiconductors, transceiver
Wolfspeed of Raleigh, NC, USA — a Cree Company that makes silicon carbide (SiC) power products and GaN-on-SiC high-electron-mobility transistors (HEMTs) and monolithic microwave integrated circuits (MMICs) — has extended its ...
Tags: Wolfspeed, silicon carbide