Micro-assembly equipment maker Finetech of Berlin, Germany says that a Lambda bonding system has been installed in the Lurie Nanofabrication Facility (LNF) at the University of Michigan in Ann Arbor. The sub-micron accuracy bonder is ...
Tags: LED, packaging equipment
ABB technology products – low-voltage switchgear, motor-controller, electrical panels and automated lighting systems – will be used to power the factory’s entire electrical system. The project includes the supply of Emax ...
Tags: ABB technology, electrical system, Emax 2
At the IEEE Honors Ceremony in New York City on 18 June, Dr David F. Welch - co-founder & president of Infinera Corp of Sunnyvale, CA, USA, a vertically integrated manufacturer of digital optical transport networking systems incorporating ...
Tags: Infinera, PICs, digital optical transport networking systems
MACOM Technology Solutions Holdings Inc of Lowell, MA, USA (which makes semiconductors, components and subassemblies for analog RF, microwave, millimeter-wave and photonic applications) has launched two packaged linear power amplifiers ...
Tags: MACOM, power amplifiers
Building on the new commitments to the Global Lighting Challenge announced in early June during the Clean Energy Ministerial, the US Department of Energy (DOE) is announcing funding for nine research and development projects that will ...
Sophia University in Japan has developed a technique for growing laser diodes on an indium phosphide (InP) layer bonded to silicon (Si) [Keiichi Matsumoto et al, Appl. Phys. Express, vol9, p062701, 2016]. The researchers claim that this is ...
Tags: Laser Diodes, Si Substrates
Ireland's Tyndall National Institute (based at University College Cork) is leading the European consortium TOP-HIT (Transfer-print OPerations for Heterogeneous INtegration) to develop novel technology that will address the challenge of ...
Paper-based packaging solutions provider Smurfit Kappa, along with egg producer Domaine du Tauzia, has developed a Pouch-Up packaging solution for liquid eggs. The new pack, which is lightweight and unbreakable, is available in two ...
Tags: packaging, Liquid Eggs
Leveraging the convergence between its packaging and security printing activities, Agfa positions itself as a strategic partner for advanced packaging applications. It sees the Touchpoint Packaging as a suitable platform for a dialog with ...
Tags: Touchpoint Packaging, packaging
STMicroelectronics of Geneva, Switzerland says that its silicon carbide (SiC) metal–oxide–semiconductor field-effect transistor (MOSFET) devices have enabled the ZapCharger Portable (claimed to be the world's smallest ...
Tags: transistor, Electric-Car Charger
A new highly efficient power amplifier (PA) based on silicon-on-insulator (SOI) CMOS could help to make possible next-generation cell phones, low-cost collision-avoidance radar for cars and lightweight microsatellites for communications, ...
Tags: Power Amplifier, Cell Phones
Researchers in Hong Kong and USA have developed indium arsenide (InAs) quantum dot (QD) microdisk lasers directly integrated on silicon (Si) with performance comparable to the best reported for similar devices on gallium arsenide (GaAs) ...
Tags: InAs quantum dot microdisk lasers InAs GaAs substrates
Turn-key back-end production services firm Presto Engineering Inc of San Jose, CA, USA (which provides semiconductor product engineering & test and supply chain management to integrated device manufacturer, fabless and electronics ...
Tags: Presto RF testing
VisIC Technologies Ltd of Nes Ziona, Israel, a fabless developer of power conversion devices based on gallium nitride (GaN) metal-insulator-semiconductor high-electron-mobility transistors (MISHEMTs) founded in 2010, has introduced a ...
Freebird Semiconductor Corp of North Andover, MA, USA, which manufactures high-reliability gallium nitride (GaN) high-electron-mobility transistor (HEMT) products for power semiconductor technologies in the commercial space-flight ...