Imec and PVA Tepla claim a breakthrough in the detection of through-silicon via (TSV) voids in 3D stacked IC technology. They used GHz scanning acoustic microscopy (SAM) technology to detect TSV voids at wafer-level after TSV Copper ...
Tags: Imec, PVA Tepla, through silicon, 3D stacked IC technology
Toumaz has said in a trading update for the year ended 31 December 2012 that EBITDA loss will be in the region of £10.9m compared with a loss of £6.1min 2011. "The increase in costs resulted from increased investment in new ...
Tags: Toumaz, loss, Radio Business, company news
Dresden University spin-off Heliatek claims to have measured a record 12.0% cell efficiency for its organic solar cells. The work was carried out in cooperation with the University of Ulm and TU Dresden, was measured by the ...
STMicroelectronics has introduced high-side switch ICs which can be use to replace conventional relays for vehicle electronics such as lights and body modules. The switches are available in a common package style so that modules suppliers ...
Tags: STMicroelectronics, high-side switch ICs, vehicle electronics
XMOS is aiming for embedded industrial designs with the introduction of industrial Fieldbus capabilities within its xCORE family of multicore microcontrollers. Initially, this will include Fieldbus xSOFTip soft peripherals and an ...
Tags: XMOS, industrial designs, Multicore Chips
Cambridge Nanotherm has launched a new design of metal-backed PCB made from a ceramic dielectric which is claimed to significantly reduce LED die temperatures, in luminaire designs. The dielectric thermal conductivity of the material ...
Tags: Cambridge Nanotherm, metal-backed PCB, luminaire designs
Micromechanical chips that pump chemicals and living cells around them are already being used to amplify DNA strands and make health diagnoses. Now a new use for these miniature microchip marvels is being patented in the US: blowing things ...
Samsung was the third largest foundry in 2012 and expects to be the second largest foundry in 2013, says IC Insights. TSMC's 2012 sales were almost 4x that of second-ranked GlobalFoundries and more than 10x the sales of the fifth-ranked ...
Tags: Samsung, IC Insights, company news
Swiss IGBT driver manufacturer CT-Concept is to open custom design centre in Ense, Germany. It will develop semi-custom gate-drive designs based on its driver cores, and produce full-custom drivers using the firm's Scale-2 chipset for ...
Tags: IGBT driver, driver cores, chipset
Dell may be sold to private equity, reports Bloomberg, with the computer company said to be talking to two private equity companies - Texas Pacific Group and Silver Lake. The reports surfaced after Dell's corporate strategy boss left to ...
Tags: Dell, private equity, company news
Fab equipment spending saw a drastic dip in 2H12 and 1Q13 is expected to be even lower, says SEMI, which reckons that the projected number of facilities equipping will drop from 212 in 2012 to 182 in 2013. Spending on fab equipment for ...
Manufacturer's organisation EFF is urging Britain’s manufacturers to get to grips with REACH, a European Directive banning certain chemicals, "or face the prospect of unlimited fines or prison", it said. Not to be confused with RoHS ...
Anglia Components has made is biggest move into the online component distribution market with the launch of a website for design engineers. The website, called Anglia Live, will give visibility of the volume availability of ...
Tags: Anglia Components, online component distribution, design engineers
Atmel has expanded its ARM Cortex-M4 processor-based flash microcontroller family to include devices with extra connectivity peripherals, a floating point unit (FPU), analogue capabilities, and higher processing power. The SAM4E ...
Tags: Atmel, flash microcontroller, connectivity peripherals
RF Micro Devices has developed an ISM-band radio device for smart meters. The RFFM6403 operates in the 405MHz–475MHz frequency range, and so will support wireless links in general 433/470MHz ISM band systems. The chip is designed ...
Tags: RF Micro Devices, radio device, smart meters