Archroma plans to showcase its solutions and expertise to improve the optical and functional properties of board and paper during the Paperex 2017 event to be held next month in India. The Switzerland-based color and specialty chemicals ...
Spanish frozen seafood company Original Gourmet has selected RPC Superfos’ reusable polypropylene packaging solution for its shellfish range. The Spanish firm selected RPC’s injection moulded rigid SuperCube pack to replace ...
Stratasys, a provider of applied additive technology solutions, announced that GKN Driveline Florence, a plant of leading global engineering company, GKN, is expanding the deployment of Stratasys 3D printing across the manufacturing floor ...
Tags: 3D Printing, GKN Driveline
US-based Avery Dennison has introduced new label solution designed to bond with the tyre during the vulcanization process. The new vulcanized tyre labels are engineered so it can take the heat while supporting the whole making process of ...
Tags: Avery Dennison, label
Glass and plastic manufacturer Bormioli Rocco Pharma has developed advanced packaging solutions for the pharmaceutical market. The new packaging solutions include AccuRec, Delta type I glass vials, Safe&Easy, Nesat and Amber type I glass ...
DS Smith’s business unit Worldwide Dispensers Europe has developed a new screw cap adapter for bag-in-box packaging with an external tamper evident ring. The new screw cap adapter has been developed to replace previous system with ...
Tags: Bag-in-Box Packaging, Packaging
RPC Group subsidiary RPC Massmould has introduced a next-generation sports cap to provide maximum product safety and integrity with enhanced consumer convenience. Developed in conjunction with RPC Astra Plastique, the new Secure Flip ...
Tags: RPC, Sports Cap
Toshiba Electronic Devices & Storage Corp (TDSC) - spun off from Toshiba Corp in July - has enhanced its diode portfolio with the addition of six Schottky barrier diodes (SBDs) fabricated with silicon carbide (SiC) and housed in ...
Tags: Toshiba, Schottky Barrier, Package
This month sees the launch in Grenoble, France of the three-year, €7.2m European Union ‘Horizon 2020’ project ModulED, which brings together 10 European research institutes, key members of the automotive-industry value ...
Toyo Printing Inks plans to exhibit its latest innovations in food and non-food packaging solutions during the Eurasia Packaging Fair 2017 in Istanbul, Turkey. The solutions to be demonstrated by the printing ink manufacturer are claimed ...
Tags: Toyo Printing, Packaging
Vetter has unveiled plans to expand the secondary packaging capabilities at its facility in Ravensburg, Germany. Vetter’s existing secondary packaging facility is being expanded to meet the growing customer needs and market demand ...
Siegwerk, a provider of printing inks for packaging applications and labels, has expanded its digital ink footprint by opening a new production facility for inkjet inks in France. The firm has expanded its technical center in Annemasse, ...
Tags: Siegwerk, packaging, printing inks
GlobalFoundries of Santa Clara, CA, USA (one of the world’s largest semiconductor foundries, with more than 250 customers and operations in Singapore, Germany and the USA) has announced its vision and roadmap for a range of technology ...
Tags: semiconductor, wireless networks
Aurora Plastics has acquired US-based S&E Specialty Polymers for an undisclosed sum. Based in Lunenburg of Massachusetts, S&E Specialty Polymers produces polymers, custom plastics and compounds for use in various applications, including ...
Tags: Aurora Plastics, Polymers
Songwon has commissioned a second thermoplastic urethane (TPU) production line, to become operational in the fourth quarter of 2017, as part of its global expansion strategy The company’s plant in Suwon, South Korea will be extended ...