Semiconductor packaging and electronic assembly solutions provider Kulicke & Soffa (K&S) has expanded its advanced packaging presence with the acquisition of privately held Dutch packaging company Liteq. Financial terms of the acquisition ...
Tags: Semiconductor packaging, packaging
At Semicon China 2017, executives at chip giant Intel, IC packager Advanced Semiconductor Engineering, equipment vendors ASML, Lam Research and Tokyo Electron (TEL), and nano-electronics research institute Imec talked about innovation to ...
Tags: IC, Semiconductor, IC Industry
Anokiwave Inc of San Diego, CA, USA, which provides highly integrated silicon core chips and III-V front-end integrated circuits for millimeter-wave (mmW) markets and active electronically scanned array (AESA)-based terminals, has added to ...
Tags: Anokiwave, Asia-Pacific region, appointment
Financial results posted by leading chip manufacturer Intel and key lithography system supplier ASML suggest that demand in the microelectronics industry – a key sector for laser companies – is to remain strong. Following ...
Tags: ASML, microelectronics industry, laser
Last week nanotechnology research institute imec of Leuven, Belgium celebrated its 30th anniversary. Founded in 1984 as a non-profit organization, imec has grown to be a multi-disciplinary expertise center in the fields of semiconductor ...
Tags: FinFETs, III-V CMOS, ASML of Veldhoven, TSMC
Tech companies are hanging onto record amounts of cash, and industry watchers want to see more of it reinvested in the companies or distributed to shareholders. FactSet, a financial research firm, tallied all the cash and marketable ...
Tags: Computer Products, software, webservice
Back-end segment and the wafer-level packaging (WLP)-related segments ruled the semiconductor market during the year Global semiconductor capex on manufacturing equipment declined 16.1% during 2012 to $37.8bn compared to 2011, according ...
EUV may not be ready for the 10nm process node and may have to wait for production readiness until the 7nm node, IBM said at the Common Platform Alliance meeting in New York earlier this week. "We are talking about real physics challenges ...
Tags: EUV, process node, production readiness
Taiwan Semiconductor Manufacturing Co. (TSMC) plans to start using 450-millimeter wafers to build its processors in 2018, following delays in the development of the new manufacturing technology. TSMC, a contract manufacturer of smartphone ...
Tags: TSMC, wafer production, Computer Products
$4 billion agreement will see the world's leading chip maker fund R&D and take an equity stake in ASML. Eric Meurice:pushing Moore's law Intel is set to acquire up to a 15%equity stake in the semiconductor equipment specialist ...
IDG News Service - Following Intel's lead, contract chip maker Taiwan Semiconductor Manufacturing Co. (TSMC), is investing A!838 million (US$1 billion) in Netherlands tools maker ASML to speed up the development of faster and more ...
Tags: Intel, Taiwan Semiconductor Manufacturing, ASML, Smaller Chips
Intel will take a stake in semiconductor tools company ASML and invest in its research and development efforts,to advance manufacturing technologies that will help Intel produce smaller and more power-efficient chips,the chip maker ...
Tags: Intel, Tools Maker ASML, chip manufacturing
Belgian lab IMEC was founded on semiconductor process research,and has grown into one of the two organisations in the world that companies partner with for advanced process research.The other is IBM. TSMC partners IMEC for advanced ...
Samsung will invest €503m to acquire 3% in ASML Samsung Electronics has signed an agreement with Dutch chipmaker ASML to invest €779m in the latter's Customer Co-Investment Program that aims to develop new chip making ...
Tags: new chip, Samsung, ASML, semiconductor
The transaction is expected to close in the first half of 2013 Dutch chipmaker ASML has agreed to acquire the US based Cymer for €1.95bn to accelerate the development of extreme ultraviolet (EUV) semiconductor lithography technology. ...
Tags: ASML, extreme ultraviolet, semiconductor lithography, smartphones, tablets