At the Touch Taiwan 2018 exhibition at the Taipei Nangang Exhibition Center (29-31 August), vertically integrated LED firm Lextar Electronics Corp of Hsinchu Science Park, Taiwan is unveiling its micro-LED chip capabilities (with a die size ...
Tags: Micro-LED, RGB Display Module
Osram Opto Semiconductors GmbH of Regensburg, Germany is expanding its existing portfolio for flash applications with a product featuring a specially developed chip-scale package (CSP). With Ceramos C, Osram is following the trend for ...
Tags: Osram, Mobile Devices
Packaging solutions provider CSP Technologies is expanding its Auburn manufacturing facility in Alabama, US for increased manufacturing and warehousing space. The manufacturing and warehousing capacity of the facility is being expanded by ...
Tags: Packaging, warehousing space
LED maker Lumileds of San Jose, CA, USA has unveilled its highest-flux-density LED. Packaged in a compact 4.0mm x 4.0mm footprint, LUXEON V can be driven harder than other LEDs in its class, it is reckoned, due to new die and packaging ...
As demand for LED end devices has resumed growth amid shortages of LED chip supply, China's LED makers have recently begun expanding their capacities and local governments are also planning new subsidy and investment programs to assist the ...
Tags: LED chip, LED packaging
LED maker Lumileds of San Jose, CA, USA says that it is the only company to meet the Premium specifications of the DesignLights Consortium (DLC) in four main product families. LUXEON LEDs, within the high-power, color, chip-on-board (CoB) ...
Cambridge Nanotherm Ltd of Haverhill, Suffolk, UK, a producer of nanoceramic thermal management technology, says that its Nanotherm LC thermal management solution addresses the unique needs of chip-scale packaged (CSP) LEDs. CSP LEDs have ...
South Korean LED maker Seoul Semiconductor Co Ltd is now mass producing its new 'WICOP' products, with a luminous efficiency of 210lm/W (350mA). Composed of just an LED chip and phosphor, it does not require chip packaging (e.g. frames ...
Tags: Seoul Semiconductor, LEDs, WICOP
Samsung Electronics Co Ltd of Seoul, Korea has launched Fx-CSP - a line-up of LED packages featuring chip-scale packaging (CSP) and flexible circuit board technology - for use in automotive lighting applications. "Our new Fx-CSP line-up ...
Samsung Electronics Co Ltd of Seoul, South Korea has introduced a full line-up of chip-scale LED packages (CSP), including 0.6W-class and 3W-class packages, CSP arrays, and PoW (Phosphor on Wafer) packages. Samsung says that its CSP ...
Continental Structural Plastics (CSP) has announced it has signed a memorandum of understanding with Mitsubishi Rayon (MRC) regarding the development and manufacturing of innovative carbon fiber structural components for the automotive ...
Tokyo-based Solar Frontier - the largest manufacturer of CIS (copper indium selenium) thin-film photovoltaic (PV) solar modules – and TSK Group of Gijón, Spain (a business group in engineering development and the supply of ...
LED manufacturers had an especially tough year in 2015. Despite rising LED lighting market demands, and large scale replacements of traditional luminaires, the oversupply situation in the market has caused average sales price (ASP) of LEDs ...
Tags: LED Industry, LED package
Plessey announced today that its dotLED range, designed specifically for wearable applications, has been expanded with a wider selection of colours, including red, green and blue. The extremely small LED die have a footprint of only 0.2mm x ...
Tags: Plessey, dotLED, Wearable Devices
Appropriately themed “Envision the future of lights” after its mission, the 20th edition of the Guangzhou International Lighting Exhibition had participants sharing inspirational ideas and innovative technologies. Dialogue of ...