Chip Scale Packaging articles & resources on Made-in-China.com

POET's Revenue Grows 11.7% in Q2

Aug 20, 2018

For second-quarter 2018, POET Technologies Inc of Toronto, Canada and San Jose, CA, USA — a designer and manufacturer of optoelectronic devices, including light sources, passive waveguides and photonic integrated circuits (PIC) for ...

Tags: photonic product, POET

China's Nationstar Enters Top 10 Ranking of Packaged LED Firms in Q2/2017, as MLS Rises to 4th

Oct 10, 2017

After narrowly missing out on entering IHS Markit’s top 10 for 2016 and first-quarter 2017, Nationstar (whose primary markets are lighting and signage) has broken into the top-10 ranking for packaged LED firms for Q2/2017, according ...

Tags: LED market, Packaged LED

Lumileds Launches 1700lm Single-Die LED

Aug 2, 2017

LED maker Lumileds of San Jose, CA, USA has unveilled its highest-flux-density LED. Packaged in a compact 4.0mm x 4.0mm footprint, LUXEON V can be driven harder than other LEDs in its class, it is reckoned, due to new die and packaging ...

Tags: Lumileds, LED

Rudolph Secures Multiple Orders for Firefly Inspection System

May 3, 2017

Rudolph Technologies has secured multiple orders from two advanced packaging service suppliers for its Firefly inspection systems. The system helps manufacturers in identifying defects earlier in the process, improving reliability of ...

Tags: advanced packaging, semiconductor

LED Tight Supply to Remain Until 3Q17

Apr 20, 2017

Supply of LED chips produced by China- and Taiwan-based makers has been tight and the situation will remain until the third quarter of 2017 when major China makers ramp up their new production capacity, according to China-based LED ...

Tags: LED chips, LED device

Samsung Launches Line-up of LED Components for Automotive Lighting, Featuring CSP

Jun 23, 2016

Samsung Electronics Co Ltd of Seoul, Korea has launched Fx-CSP - a line-up of LED packages featuring chip-scale packaging (CSP) and flexible circuit board technology - for use in automotive lighting applications. "Our new Fx-CSP line-up ...

Tags: Samsung, LEDs, CSP

Cadence Offers IC Design Solutions For Fan-out Wafer-Level Chip Scale Packaging

Mar 16, 2016

Cadence Design Systems is offering complete IC packaging design and analysis solutions for advanced fan-out wafer-level chip scale packaging (WLCSP) and 2.5D interposer-based designs. Designed to accelerate the multi-chip integration for ...

Tags: Cadence Design system, IC, Packaging

GaN Systems Announces 10x Production Increase at TSMC

Dec 2, 2015

GaN Systems Inc of Ottawa, Ontario, Canada, a fabless developer of gallium nitride (GaN)-based power switching semiconductors for power conversion and control applications, says that Taiwan Semiconductor Manufacturing Corporation (TMSC, the ...

Tags: GaN Systems, E-mode GaN FETs, TSMC

Guangzhou International Lighting Exhibition 2015 Ends on a Bright Note

Nov 13, 2015

Appropriately themed “Envision the future of lights” after its mission, the 20th edition of the Guangzhou International Lighting Exhibition had participants sharing inspirational ideas and innovative technologies. Dialogue of ...

Tags: Lighting, UV LED, IR LED

Plessey's LED Filaments with its MaGIC™ Die Unveiled

Nov 13, 2015

Plessey today announced the launch of its range of LED filaments, manufactured with the company’s MaGICTM GaN-on-Silicon LEDs. The filaments are designed for the surging filament bulb market where these replacement lamps have far ...

Tags: Plessey, LED filaments, incandescent lamps

Lattice Power CTO: Low and Mid-Power LED Chip Becomes Major Trend in the Industry

Nov 12, 2015

The LED industry is gradually maturing in 2015, with products cost/performance (C/P) ratio becoming increasingly important. Low and mid-power flip chip products are increasingly valued by the industry. To further understand this trend ...

Tags: LED industry, LED chip, Chip Scale Packaging

Lumileds Extends CSP LED Range with LUXEON Flipchip White

Sep 23, 2015

LED maker Lumileds of San Jose, CA, USA has launched the LUXEON FlipChip White LED, which uses chip-scale packaging (CSP) technology. After spearheading the adoption of CSP in LEDs, Lumileds has shipped more than 500 million LED emitters ...

Tags: Lumileds, LUXEON FlipChip White LED, high-lumen applications

Plessey Launches Range of LED Filaments Using GaN-on-Si Die

Aug 10, 2015

UK-based Plessey has launched its range of LED filaments, manufactured with the firm's MaGIC (Manufactured on GaN-on-Si I/C) gallium nitride on silicon LEDs. The filaments are designed for the surging filament bulb market, where these ...

Tags: LED Filaments, GaN-on-Si Die

Plessey Expands Distribution Network

Apr 14, 2015

Plessey Semiconductors of Plymouth, UK has expanded the European network for its GaN-on-silicon LED products by entering into a sales representative agreement with electronics distributor ROM Electronik Ltd (based near Istanbul) for ...

Tags: Plessey, ROM Elektronik Partnership

Epistar and Tsmc Approved a Sale of Tsmc Solid State Lighting Shares

Jan 13, 2015

Epistar Corp. and Taiwan Semiconductor Manufacturing Co. (TSMC ) held Board of Directors’ meetings today and approved a sale of TSMC Solid State Lighting (TSMC SSL) shares. Epistar will acquire all shares of TSMC SSL held by TSMC and ...

Tags: LED lighting products, packaging technology, Lights

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