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Electronic Components
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27 of The Hottest Chinese Wholesale Product Categories on The Market
Jun 27, 2019Chinese wholesale products are used in industries and markets across the world. Keep reading to discover some of the hottest Chinese Wholesale Product categories that are well known for having high quality merchandise, and great wholesale ...
Tags: Wholesale Product
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Peregrine Changes Name to Psemi, as It Celebrates 30th Anniversary and Ships 4 Billionth Chip
Jan 19, 2018Peregrine Semiconductor Corp of San Diego, CA, USA – a fabless provider of radio-frequency integrated circuits (RFICs) based on silicon-on-insulator (SOI) – has announced its corporate name change to pSemi Corp, a Murata company ...
Tags: Semiconductor, integrated circuit
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Philips Photonics-LED European Consortium Completes VIDaP VCSEL Project
Sep 28, 2017Philips Photonics of Ulm, Germany - which provides vertical-cavity surface-emitting laser (VCSEL) technology for datacom, consumer and industrial applications - has completed ‘VIDaP’ (VCSEL Pilot Line for Illumination, Datacom ...
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MACOM Exhibiting Portfolio Enabling Optical Network Connectivity at 100G, 400G and Beyond at Ecoc
Sep 19, 2017MACOM Technology Solutions Inc of Lowell, MA, USA (which makes semiconductors, components and subassemblies for analog RF, microwave, millimeter-wave and photonic applications) is showcasing its portfolio of optoelectronics and photonic ...
Tags: semiconductors, components
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Serac Unveils High Speed Capping Machine for Bottles
Jul 5, 2017Serac has unveiled a new eMC capper machine to meet the needs of manufacturers who decide to operate less industrial sites and concentrate their production. The machine, which is configured with 12 heads, will be able to give an output of ...
Tags: Serac, Capping Machine
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Seoul Semiconductor Files German Patent Lawsuit Against Mouser Concerning Everlight's Mid-Power LEDs
May 26, 2017On 28 April, Seoul Semiconductor Europe GmbH of Munich, Germany (a subsidiary of South Korean LED maker Seoul Semiconductor Co Ltd) filed a patent infringement claim in Germany at the District Court of Düsseldorf against global ...
Tags: Mid-Power LEDs, Electronics
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Herma Develops New Packaging Concept for Labellers
Oct 28, 2016Herma has developed a new packaging concept for its labellers for shipping and distributing in an effective manner. The company designed new standardised cases with die-cut and made-to-measure corrugated inserts for most of its ...
Tags: Herma, Packaging Concept, Labellers
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Technavio Details Top Four Drivers of RF IC Market
Sep 7, 2016The global radio frequency (RF) IC market will increase at a compound annual growth rate (CAGR) of nearly 12% from 2016 to 2020, forecasts a report by Technavio. Asia-Pacific (APAC) is expected to be the main demand-generating region and ...
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TDK, Toshiba Agree to Establish JV for Automotive Inverter Business
Sep 7, 2016TDK Corporation and Toshiba Corporation have agreed to establish a joint venture, TDK Automotive Technologies Corporation, to develop and manufacture automotive inverters for hybrid vehicles, plug-in hybrids and electric vehicles. I. ...
Tags: TDK, Toshiba, joint venture
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Cortech Launches New Protective Packaging Paper for Metals
Aug 24, 2016Cortech has introduced new CorShield VpCI-146 reinforced paper, which can be used as a protective packaging for sharp or oddly shaped metals. The firm’s Vapor phase Corrosion Inhibiting (VpCI) paper is also a better packaging option ...
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Coca-Cola's Bottler SBGS Selects Sacmi's Ultra-Clean Filling Process
Aug 3, 2016Coca-Cola Group bottler Société des Boissons Gazeuses du Souss (SBGS) has selected Sacmi solutions for its ultra-clean filling process. SBGS will produce bottles of one of Moocco's biggest water brands Ciel using Sacmi's ...
Tags: Filling Process, Coca-Cola
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Three-Year €33m European Project Reference to Extend RF-Soi Technology for Above-1GB/S 4G+ Wireless Front-End Modules
Jul 12, 2016The pan-European REFERENCE research project - created to leverage disruptive radio-frequency silicon-on-insulator (RF-SOI) technology in developing industrial solutions for the performance, cost and integration needs of RF front-end modules ...
Tags: RF-SOI, ECSEL, 4G+communications
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Ascend to Give Presentaton on Enhanced Hydrolysis and Thermal Resistant Polyamide for Automotive Applications
May 11, 2016Ascend Performance Materials will be giving a technical presentation on “Enhanced Hydrolysis & Thermal Resistant PA66 for Automotive Engine Cooling Applications” at the 11th Annual SPE Automotive Engineering Plastics Conference ...
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Arrow to Distribute Lumileds' LEDs, Arrays, Light Engines and Automotive Products Globally
May 5, 2016LED maker Lumileds of San Jose, CA, USA and Arrow Electronics announced a strategic agreement for the global distribution of Lumileds comprehensive portfolio of application-optimized LEDs including high-power, mid-power, low-power, ...
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Wolfspeed's GaN RF Devices Demonstrate Reliability for Harsh Space Environments
Apr 15, 2016Wolfspeed of Research Triangle Park, NC, USA – a Cree Company that makes silicon carbide (SiC) and gallium nitride (GaN) wide-bandgap semiconductor devices – says that its GaN-on-SiC RF power transistors have completed testing ...
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