© Semiconductor Today Magazine / Juno Publishing The global market for millimetre-wave and microwave RF transceivers (including applications in mobile phones, tablets, smart TVs, PCs and laptops, and set-top boxes) will grow at a ...
Tags: Microwave RF Transceiver, smart TV
Philips Photonics of Ulm, Germany - which provides vertical-cavity surface-emitting laser (VCSEL) technology for datacom, consumer and industrial applications - has completed ‘VIDaP’ (VCSEL Pilot Line for Illumination, Datacom ...
The global compound semiconductor market will rise at a compound annual growth rate (CAGR) of 8.47% during 2017-2021, forecasts market research firm Technavio. The report ‘Global Compound Semiconductor Market 2017-2021’ ...
The global radio frequency (RF) IC market will increase at a compound annual growth rate (CAGR) of nearly 12% from 2016 to 2020, forecasts a report by Technavio. Asia-Pacific (APAC) is expected to be the main demand-generating region and ...
The pan-European REFERENCE research project - created to leverage disruptive radio-frequency silicon-on-insulator (RF-SOI) technology in developing industrial solutions for the performance, cost and integration needs of RF front-end modules ...
Tags: RF-SOI, ECSEL, 4G+communications
ICT-STREAMS, a part of the European Union Horizon 2020 program, is a new three-year project launched on 1 February (followed by a kick-off meeting at the Aristotle University of Thessaloniki, Greece on 24-25 February) with the goal of ...
Tags: III-Vs-on-Si, silicon photonics
STMicroelectronics of Geneva, Switzerland says that its silicon carbide (SiC) metal–oxide–semiconductor field-effect transistor (MOSFET) devices have enabled the ZapCharger Portable (claimed to be the world's smallest ...
Tags: transistor, Electric-Car Charger
Nanoelec Research Technological Institute (IRT) in Grenoble, France - an R&D consortium headed by CEA-Leti focused on information and communication technologies (ICT) using micro- and nanoelectronics - has announced the first co-integration ...
Tags: III-Vs-on-Si, Direct wafer bonding
CEA-Leti and its partners in the European FP7 project PLAT4M today announced they have built three silicon photonics platforms. The four-year project, which launched in 2013, aims at building a European-based supply chain in silicon ...
Tags: Leti, Silicon Photonics
Micro/nanotechnology R&D center CEA-Leti of Grenoble, France and its partners say that they have built three silicon photonics platforms, as they reach the mid-point of the four-year European Union Seventh Framework Program (EU FP7) project ...
Tags: Leti, silicon photonics, STMicroelectronics
Applications of CCMs in the mobile phone and automotive sectors are fueling camera module revenues. Driven by the mobile phone and automotive sectors, the sales value of the Compact Camera Module (CCM) industry will grow by a factor of by ...
Tags: Compact Camera, Camera Module
Wafer foundry houses in China have stepped up efforts to develop Fully Depleted Silicon-on-Insulator (FD-SOI), or also called Ultra-Thin Body (UTB), processes for wafer production, compared to the Fin Field-Effect Transistor (FinFET) ...
Tags: Insulator, Semiconductor, high density chips
IC foundries based in China and Taiwan are all gearing up for rapid demand growth for microelectromechanical systems (MEMS) devices driven by a new wave of expansion for the Internet of Things (IoT), according to industry observers. The ...
Tags: MEMS sensors, MEMS products
STMicroelectronics of Geneva, Switzerland has unveiled new automotive-qualified silicon carbide (SiC) diodes for on-board battery chargers (OBCs) in electric vehicles such as plug-in hybrids (PHEVs) that demand high power-handing capability ...
Tags: on-Board Battery Chargers, 650V SiC Diodes, Electrical
While prospects for the global semiconductor market look bright for this year and next, it isn’t great news for the European semiconductor companies says Future Horizons CEO Malcolm Penn. "For the first time in the history of the ...
Tags: Europeans, Semiconductor, Electrical