The supervisory board of SUSS MicroTec AG of Garching, Germany, which makes photomask aligners, laser processing systems and wafer bonders, has appointed Dr Franz Richter as a new member of the management board (with a contract running for ...
Tags: SUSS MicroTec, former company veteran, ceo
Germany-based semiconductor equipment firm Suss MicroTec and Georgia Institute of Technology (Georgia Tech) have joined hands for conducting research on nanotechnology, bio-medical and semiconductor 3D packaging. Under the arrangement, a ...
Tags: Suss Microtec, 3D Packaging
With silicon-on-insulator (SOI) business declining, 3D TSV stack implementation beginning, and the competitive environment changing, market research firm Yole Développement has released a new study 'Permanent Wafer Bonding for ...
Tags: Electrical, Electronics
The tool is designed for high volume manufacturing and can be used for exposing wafers with a diameter of up to 200 mm. This latest generation tool is a further development of the very successful MA200 Compact platform, of which the 100th ...
Tags: Components, Tools, Hardware
SEMICON Taiwan is set to open in September amidst an improving global and regional outlook for 2013 and 2014 that sees Taiwan remaining the largest and strongest market for semiconductor manufacturing. SEMICON Taiwan 2013, to be held ...
Tags: Semiconductor Market, Electrical
Rolith, Inc., the leader in developing advanced nanostructured coatings and devices, today announces partnership with Asahi Glass Co., Ltd. (AGC), one of the world’s largest glass manufacturers. The joint development agreement ...
Tags: Rolith, AGC, anti-reflective glass