WLCSP articles & resources on Made-in-China.com

Rudolph Secures Multiple Orders for Firefly Inspection System

May 3, 2017

Rudolph Technologies has secured multiple orders from two advanced packaging service suppliers for its Firefly inspection systems. The system helps manufacturers in identifying defects earlier in the process, improving reliability of ...

Tags: advanced packaging, semiconductor

EPC Issues Ninth Reliability Report

Apr 14, 2017

Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA, which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) for power management applications, has announced its Phase Nine Reliability ...

Tags: gallium nitride, FETs

Skyworks Adds MIPI Antenna Aperture Tuners

Oct 12, 2016

Skyworks Solutions Inc of Woburn, MA, USA (which manufactures analog and mixed-signal semiconductors) has broadened its antenna tuner portfolio with two new Mobile Industry Processor Interface (MIPI)-controlled devices that support ...

Tags: Skyworks, MIPI

Cadence Offers IC Design Solutions For Fan-out Wafer-Level Chip Scale Packaging

Mar 16, 2016

Cadence Design Systems is offering complete IC packaging design and analysis solutions for advanced fan-out wafer-level chip scale packaging (WLCSP) and 2.5D interposer-based designs. Designed to accelerate the multi-chip integration for ...

Tags: Cadence Design system, IC, Packaging

Adhesives Has Announced That George Sears Will Present a Paper at The 2013 IMAPS

Aug 22, 2013

A leading supplier of thermal management materials, adhesives, pottings and encapsulants to the electronics, LED and solar industries - has announced that George Sears, senior staff scientist, will present a paper at the 2013 International ...

Tags: Construction, Decoration, thermal management materials, adhesives

Japan Has Released The MB51T008A

Jul 15, 2013

Fujitsu Semiconductor Ltd of Yokohama, Japan has released the MB51T008A, a silicon-substrate-based, gallium-nitride (GaN) power device with a drain-source breakdown voltage (V(BR)DSS) of 150V. Features of the MB51T008A include: (1) ...

Tags: Power Device, Electrical

Texas Instruments Unveiled Its First Single-Stage Wireless Charging IC

Dec 26, 2012

Texas Instruments Wednesday unveiled its first single-stage wireless charging integrated chip (IC). TI said the new IC is 60% smaller than its predecessors. The company today also added a power controller chip that it said increases the ...

Tags: TI, wireless charging chip, IC, power controller chip

Atmel Has Launched an ARM Cortex-M4 Microcontroller That Consumes 90MUA/MHz in Active Mode

Sep 25, 2012

Atmel has launched an ARM Cortex-M4 microcontroller that consumes 90µA/MHz in active mode,claiming this to be the lowest yet. Called the SAM4L family,"the devices are the most efficient MCUs in the market today,achieving up to 28 ...

Tags: Atmel, ARM Cortex-M4, SAM4L-EK, LCD

20 June 2012 NXP's 0.65mm X 0.44mm X 0.2mm SiGe:C GPS LNAs Offer 0.60Db Noise Figure

Jun 20, 2012

20 June 2012 NXP's 0.65mm x 0.44mm x 0.2mm SiGe:C GPS LNAs offer 0.60dB noise figure NXP Semiconductors N.V.of Eindhoven,The Netherlands,which provides mixed-signal and standard product solutions,has unveiled the BGU8006 low-noise ...

Tags: NXP Semiconductors, WLCSP, GPS LNAs, BGU8006 LNA

Polymeric Semiconductor Material Market Was Valued at $274 Million

May 29, 2012

A new report estimates that the compound annual growth rate (CAGR) of polymer usage will increase by 26% in wafer level applications over the next 5 years. Last year, polymeric semiconductor material market was valued at $274 million, ...

Tags: Polymeric Materials, Polymer

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