Wafer Level Packaging articles & resources on Made-in-China.com

Veeco Reports Higher-Than-Expected Q2 Profits, Despite Falling Revenue From Sales of Blue LED MOCVD Systems to China

Aug 8, 2018

For second-quarter 2018, epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA has reported revenue of $157.8m, down slightly on $158.6m last quarter but up 40.6% on $112.2m a year ago. ...

Tags: Veeco, LED

Integreat Project Yields New Approaches to LED Production

Jul 19, 2018

Results have been announced for the research project ‘Integrated High-Volume Production along the LED Value-Added Chain for Large Wafers and Panels’ (InteGreat), which ran between December 2014 and February 2018 supported by the ...

Tags: packaging, LED product

Air Products to Launch New Flux-Free Soldering Technology for Wafer Level Packaging Applications

Feb 22, 2018

Air Products will introduce a break-through fluxless soldering technology using electron attachment (EA) technology for wafer level packaging applications at the IPC APEX Expo in San Diego, to be held from 27 February to 1 March. Air ...

Tags: Air Products, Wafer Level Packaging

Veeco's Q2 Revenue up 21% Year-on-Year Organically

Aug 9, 2017

For second-quarter 2017, epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA has reported revenue of $115.1m, up 22% on $94.4m last quarter and up 53% on $75.3m a year ago. However, this includes ...

Tags: process equipment, Veeco Instruments

Kulicke & Soffa Acquires Dutch Packaging Company Liteq

Jul 12, 2017

Semiconductor packaging and electronic assembly solutions provider Kulicke & Soffa (K&S) has expanded its advanced packaging presence with the acquisition of privately held Dutch packaging company Liteq. Financial terms of the acquisition ...

Tags: Semiconductor packaging, packaging

Kulicke & Soffa to Take Part at SEMICON West 2017

Jul 12, 2017

Kulicke & Soffa said it will participate at SEMICON West trade show, which is being held in San Francisco, California. The company will give a video illustration of its lithography solution, developed for advanced packaging at the trade ...

Tags: SEMICON West, EV

Mentor Introduces Xpedition High-Density Advanced Packaging Flow Solution

Jun 7, 2017

Siemens business unit Mentor has introduced a new solution for the design and verification of the existing IC package designs. The Mentor Xpedition High-Density Advanced Packaging (HDAP) flow solution can be used for rapid prototyping ...

Tags: Siemens, Packaging Flow

Rudolph Secures Multiple Orders for Firefly Inspection System

May 3, 2017

Rudolph Technologies has secured multiple orders from two advanced packaging service suppliers for its Firefly inspection systems. The system helps manufacturers in identifying defects earlier in the process, improving reliability of ...

Tags: advanced packaging, semiconductor

Kulicke & Soffa Launches Wafer Dicing Solution For Advanced Packaging

Mar 21, 2016

Kulicke & Soffa Industries has launched new FCC Hub Blades, extending the successful AccuPlus series. The new FCC Hub Blades offer a customizable solution for flip chip, wafer level packaging (WLP) and thick wafer dicing with improved ...

Tags: KulickeSoffa, FCC Hub Blades, AccuPlus series

Veeco Wins Advanced Packaging System Orders From Asian Foundry

Dec 25, 2015

Epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA has received multiple orders from a leading foundry in Asia for its Precision Surface Processing (PSP) WaferStorm system (a platform that provides ...

Tags: Veeco Wet processing, Veeco Instruments Inc, Electronics

Veeco Wins Multiple Advanced Packaging System Orders in Asia

Dec 25, 2015

Veeco Instruments has received multiple orders from a leading foundry in Asia for its Precision Surface Processing (PSP) WaferStorm system. The WaferStorm platform provides wafer processing solutions for advanced packaging applications. ...

Tags: Veeco Instruments, Fan-out Wafer Level Packaging, Packaging

Ultratech Receives Large Multiple System Order for Fan-out Wafer-Level Packaging Application

Oct 21, 2015

Ultratech, a supplier of lithography, laser--processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HBLEDs), as well as atomic layer deposition (ALD) systems, today announced that it has ...

Tags: Wafer-Level Packaging, LEDs

China IC Foundries Gearing up for MEMS Market Boom

Sep 16, 2015

IC foundries based in China and Taiwan are all gearing up for rapid demand growth for microelectromechanical systems (MEMS) devices driven by a new wave of expansion for the Internet of Things (IoT), according to industry observers. The ...

Tags: MEMS sensors, MEMS products

SPTS Achieves $1bn Export Sales From Wales Headquarters

Sep 15, 2015

SPTS Technologies Ltd (an Orbotech company that manufactures etch, PVD and CVD wafer processing solutions for the MEMS, advanced packaging, LED, high-speed RF on GaAs, and power management device markets) has surpassed $1bn in cumulative ...

Tags: SPTS, packaging, wafers

Taiwan's AWSC Purchases Classone's Solstice S8 Electroplater

Apr 7, 2015

ClassOne Technology of Kalispell, MT, USA, which manufactures wet-chemical processing equipment (especially for cost-conscious emerging markets and users of smaller substrates), has delivered a fully automated Solstice S8 electroplating ...

Tags: AWSC, MMIC, Electrical

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