- Location
Xilinx
"-
How Big Is The Gap Between China and The United States CPU
Dec 12, 2016China military (DI:fbi517549070) has been a large number of Chinese on the chip to rely on imports, and the cost of the purchase of the chip has been more than the cost of oil, but also in the United States Intel CPU, AMD, IBM. There are ...
Tags: China, The United States, CPU
-
CREE Launches Doherty PA Reference Design
Feb 2, 2015To address the needs of small-cell designers, Cree Inc of Durham, NC, USA, which makes silicon carbide (SiC) and gallium nitride (GaN) wafers and devices, has introduced the CDPA35045 asymmetric Doherty power amplifier (PA) reference design ...
-
Digi-Key Has Grown and Grown Into One of The Largest Electronic-Component Distributors
Feb 7, 2014In the 42 years since its founding, Digi-Key Corp. has grown—and grown—into one of the world’s largest electronic-component distributors. Its online catalog features nearly a million parts and products. Last year it sold ...
Tags: Mouser Electronics, IEEE Spectrum, SpaceX, Digi-Key
-
Imec Has Grown to Be a Multi-Disciplinary Expertise Center
Jan 21, 2014Last week nanotechnology research institute imec of Leuven, Belgium celebrated its 30th anniversary. Founded in 1984 as a non-profit organization, imec has grown to be a multi-disciplinary expertise center in the fields of semiconductor ...
Tags: FinFETs, III-V CMOS, ASML of Veldhoven, TSMC
-
IEDM 2013 Was Fabricated with a Silicon Fin Replacement Process on 300mm Silicon Wafers
Dec 13, 2013At the IEEE International Electron Devices Meeting (IEDM 2013) in Washington D.C., USA (9-11 December), nanoelectronics research institute imec of Leuven, Belgium reported the first functional strained germanium (Ge) quantum-well channel ...
Tags: FinFETs III-V CMOS, Electrical, Electronics
-
What Belgium Claims Are The First III-V Compound Semiconductor FinFET Devices
Nov 6, 2013By using a unique silicon fin replacement process, Imec of Leuven, Belgium has demonstrated what it claims are the first III-V compound semiconductor FinFET devices integrated epitaxially on 300mm silicon wafers. The nanoelectronics ...
Tags: FinFETs III-V CMOS, Electrical, Electronics
-
The Dual-Rate 100g CFP2 Lr4 Transceiver Joined That Module in Volume Production
Sep 20, 2013Oclaro Inc of San Jose, CA, USA, which provides lasers and optical components, modules and subsystems for the optical communications, industrial, and consumer laser markets, says that the dual-rate 100G CFP2 LR4 transceiver (which is fully ...
Tags: Oclaro InP CFP2 CFP, Electrical, Electronics
-
The Optical Internetworking Forum Is Hosting a Record Number
Sep 18, 2013In booth 360 at the European Conference on Optical Communications (ECOC 2013) in London, UK (23-25 September), the Optical Internetworking Forum is hosting a record number of multi-vendor interoperability demonstrations. Addressing a wide ...
-
Ascent Solar Has Appointed Bill Gregorak as Chief Financial Officer
Sep 13, 2013Ascent Solar Technologies Inc of Thornton, CO, USA, which makes lightweight copper indium gallium diselenide (CIGS) thin-film photovoltaic modules, has appointed Bill Gregorak as chief financial officer. Prior to joining Ascent Solar, ...
Tags: Ascent Solar CIGS, Electrical, Electronics
-
Worldwide Industrial Electronics Chip Revenue in The First Quarter Reached $7.71 Billion
Aug 16, 2013The market for semiconductors used in industrial electronics applications relished a better-than-expected first quarter as macroeconomic headwinds turned out to be less severe than initially feared, according to the latest Industrial ...
Tags: Electrical, Electronics, semiconductors
-
Xilinx and Ltd Are Collaborating to Reduce CapEx and OpEx
May 22, 2013Xilinx Inc of San Jose, CA, USA, which provides all-programmable field-programmable gate arrays (FPGAs), systems-on-chip (SoCs) and 3D ICs, and Japan's Sumitomo Electric Industries Ltd are collaborating to reduce capital expenditure (CapEx) ...
Tags: SEI, Electrical, Electronics
-
LMS6002D Has Been Adopted by Eurecom for Its ExpressMIMO2 Baseband Platform
Apr 23, 2013Lime Microsystems has said its field programmable RF transceiver, LMS6002D, has been adopted by Eurecom for its ExpressMIMO2 baseband platform. The LTE-A compliant (TDD/FDD) board combines four Lime Microsystems LMS6002D chips with Xilinx ...
-
"Abstractions Drive Automation," Tom Feist of Xilinx Told The Globalpress Summit
Apr 17, 2013"Abstractions drive automation," Tom Feist of Xilinx told the Globalpress Summit in Santa Cruz this week. "A thousand evaluations of the technology are going on right now," said Fiest referring to the company's Vivado FPGA design tool ...
Tags: Xilinx, video processing functions
-
FPGA Partitioning Software Firm Flexras Technologies Has Released Version 3.2
Apr 17, 2013Paris-based FPGA partitioning software firm Flexras Technologies has released version 3.2 of its Wasga compiler design suite for FPGA-based prototyping. This new release supports the Xilinx Virtex-7 FPGA and includes new features that ...
-
Applied Micro Would Combine Its 64-Bit X-Gene Chips with Altera's FPGAs in ARM Servers
Apr 17, 2013Applied Micro Circuits is aiming to make its 64-bit chip for ARM servers more powerful and flexible through a collaboration with specialized chip maker Altera. Applied Micro on Monday said it would combine its 64-bit X-Gene chips with ...
Tags: Appliedmicro, Altera Team, Arm Servers
Related Products
-
Xilinx MCU Original Electronic Components Integrated Circuit in Stock List IC Chip
-
New Arrival Banana Pi Xilinx Artix-7 Fpga Extend Board
-
Alinx Axu4EV-P: Xilinx Zynq Ultrascale+ Mpsoc Zu4eg Fpga Development Board Ai Pcie3.0 H. 265 Automotive Adas Vitis-Ai
-
Alinx Axu4EV-P: Xilinx Zynq Ultrascale+ Mpsoc Zu4eg Fpga Development Board Ai Pcie3.0 H. 265 Automotive Adas Vitis-Ai
-
Microphase Z7-Nano Xilinx Fpga Development Board Zynq Core Board 7020 7010 Pynq Dual Network Port
-
Alinx Ax7z100: Xilinx Zynq-7000 Soc Xc7z100 Zynq Arm 7100 Fpga Development Board Soms Pcie Accelerator Card SFP 8g Emmc
