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Valspar Awarded Patent for Method of Coating a Metal Substrate with Hardenable Packaging
Dec 17, 2014U.S. 8,632,857 B2 Valspar Sourcing Inc. has been awarded a patent for a method of coating a metal substrate with a hardenable packaging coating system comprised of applying an under-coat composition to a metal substrate, the under-coat ...
Tags: packaging coating system, under-coat composition, Construction c
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