Atomic layer deposition (ALD) thin-film technology firm Picosun Oy of Espoo, Finland has reported repeat sales of automated P-300BV vacuum batch production systems to major Asian discrete device manufacturers. Even if the 300mm wafer size ...
Tags: LED lighting, MEMS
Researchers in Germany have been developing an epitaxial lift-off (ELO) process that would allow gallium arsenide (GaAs) substrates to be reused for indium gallium aluminium phosphide (InGaAlP) thin-film light-emitting diode (LED) ...
X-FAB Silicon Foundries of Erfurt, Germany - a mixed-signal IC, sensor and micro-electro-mechanical systems (MEMS) foundry – has entered wide-bandgap semiconductor production by announcing the availability of silicon carbide (SiC) ...
Tags: SiC MOSFET SiC Schottky barrier diodes SiC power devices
Osram announced by raising the share of semiconductor sales from the global general lighting market could help it reduce the total cost of producing chips for LEDs at its new factory to be opened in Malaysia, reported Bloomberg. The LED ...
Tags: Osram, LED chip, general lighting
The Department of Resources Engineering under National Cheng Kung University in southern Taiwan has developed a method to separate high-purity silicon and silicon carbide from silicon slurry, a waste from making crystalline silicon solar ...
UK-based Plessey says that EDN (Electronic Design News) has named its smallest packaged gallium nitride on silicon MaGIC (Manufactured on GaN-on-Si I/C) high-brightness LEDs, the dotLED, as one of the Hot 100 Products of 2014. Chosen by ...
Tags: white LED, Electrical
At the 11th China International Forum on Solid State Lighting (SSL CHINA 2014) in Guangzhou (6-8 November), deposition equipment maker Aixtron SE of Aachen, Germany has received the ‘Award of Outstanding Achievement for Global SSL ...
MEI Wet Processing Systems and Services LLC (a subsidiary of MEI LLC) of Albany, OR, USA has revealed performance data on its new Cu & TiW Critical Etch System for compound semiconductor manufacturing. MEI says that its Critical Etch ...
Tags: Cu, spray tools, TiW etch
Directed by Infineon Technologies AG together with partners Aixtron, SiCrystal AG and SMA Solar Technology AG, the three-year German project NeuLand (begun in late 2010) has developed highly integrated components and electronic circuits ...
Materials, component and precision system supplier Ferrotec Corp, whose Temescal division of Livermore, CA, USA manufactures electron-beam-based evaporative coating systems, has unveiled the Temescal UEFC-4900, a mid-sized ...
Tags: Ferrotec, MID-Sized Auratus
Brewer Science Inc of Rolla, MO, USA, which provides thin-wafer-handling materials, processes and equipment, has unveiled the Apogee bonder for temporary wafer bonding applications. The firm says that this marks a milestone in leveraging ...
Tags: Electrical, Electronics, Industrial Equipment, Components
SAMCO Inc of Kyoto, Japan, a supplier of plasma etch, chemical vapour deposition (CVD) and surface treatment systems to compound semiconductors device makers, has relocated its US East Coast regional office. Due to a rise in customers in ...
Tags: SAMCO, chemical vapour deposition
Plessey announced the availability of its next generation GaN-on-Silicon mid-power LEDs. The product family doubles the efficacy of Plessey's first generation MAGIC™ (Manufactured on GaN-on-Si I/C) products released in February 2013. ...
Fujifilm Corporation and imec have developed a new *photoresist technology for **organic semiconductors that enables the realization of submicron patterns. (For * please see note at bottom for further explanations.) Due to their ...
Tags: Organic Semiconductors, Lighting
The company made public today the foundation of its new LED business unit, called "Azzurro LED Technologies", dedicating more resources to migrate the LED industry to GaN-on-Si. The new business unit's strategy is to license Azzurro's ...
Tags: LED, Lights, Lighting, LED Industry