- Location
wafer bonding equipment
"-
Micro-LED-Like Displays and Projection Modules to Be Available in 2018
Jul 24, 2017A major bottleneck in the commercialization of micro-LED displays is the mass transfer of micron-size LEDs to a display backplane, according to ‘3Q17 Micro LED Next Generation Display Industry Member Report: Analyses on Mass Transfer ...
-
EVG Achieves Fourth Consecutive Triple Win in Vlsiresearch Customer Satisfaction Survey
Jun 23, 2016For a fourth consecutive year, EV Group of St Florian, Austria (a supplier of wafer bonding and lithography equipment for MEMS, nanotechnology and semiconductor applications) has earned all three awards resulting from VLSIresearch Inc's ...
Tags: EV Group, focused chip
-
EVG Has Built on Its Decades of Experience with Plasma-Activated Wafer Bondin
Mar 6, 2013EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography equipment for the MEMS (micro-electro-mechanical system), nanotechnology and semiconductor markets, says that it is developing equipment and process ...
-
EV Group Has Completed Its Expanded Cleanroom IV Facility
Dec 6, 2012EV Group has completed its expanded cleanroom IV facility at its corporate headquarters in Austria, which doubled its cleanroom space for process development and pilot production services. As part of the company's long-term growth ...
Tags: EV Group, R&D facilities, wafer bonding equipment, lithography equipment
-
EV Group Has Announced a Joint Development Agreement with Eulitha AG
Jan 10, 2012EV Group has announced a joint development agreement with Eulitha AG, whereby the companies will combine their expertise in nanolithography to develop a full-field exposure tool for patterning sapphire substrates. EV Group (EVG), a supplier ...
Tags: Market View, led
Related Products
-
Semiconductor Equipment High Precision Automatic Wafer Eclectic Bonder Die Bonder Bonding Machine
-
Wafer Mounter Photonics Packaging Eutectic Bonding Machine Die Attach Equipment
-
High Speed Precision Automatic Semiconductor Equipment to IC Package Wafer Die Bond Die Bonding Attach
-
High-Speed Clip Bonder Wafer Semiconductor Packaging and Bonding Placement Equipment
-
Semiconductor Bonding Equipment High Precision Wafer Placement Accuracy Die Bonder Machine
-
High Precision Eutectic Wafer Bonder Chip Bonding Equipment with Die Attach System
