Trade Resources Economy News Editors Obtained The Quote From The Background Information

News Editors Obtained The Quote From The Background Information

By a News Reporter-Staff News Editor at Politics & Government Week - From Washington, D.C., VerticalNews journalists report that a patent application by the inventors KATO, Noboru (Nagaokakyo-shi, JP); OZAWA, Masahiro (Nagaokakyo-shi, JP), filed on August 22, 2013, was made available online on December 26, 2013.

The patent's assignee is Murata Manufacturing Co., Ltd.

News editors obtained the following quote from the background information supplied by the inventors: "The present invention relates to a circuit substrate and a method of manufacturing the same and, in particular, to a circuit substrate including a rigid region and a flexible region and a method of manufacturing the same.

"One known example of a traditional circuit substrate is a wiring substrate described in Japanese Unexamined Patent Application Publication No. 2006-339186. The wiring substrate described in Japanese Unexamined Patent Application Publication No. 2006-339186 includes a flexible section and a rigid section disposed to be contiguous to the flexible section. The flexible section includes a flexible substrate in which wiring patterns are stackedMultiple capacitor elements stacked in multi-unit arrangement to provide bulk capacitance and lower ESR.Multiple capacitor elements stackedMultiple capacitor elements stacked in multi-unit arrangement to provide bulk capacitance and lower ESR. in multi-unit arrangement to provide bulk capacitance and lower ESR. such that an insulative resin layer is disposed therebetween. The rigid section includes a flexible substrate formed integrally with the flexible section. The wiring densityA figure of merit usually expressed in Joules per cubic inch for capacitors of the wiring patterns in the rigid section is higher than that in the flexible section. Thus, the rigid section has a higher hardness than that of the flexible section.

"However, for the wiring substrate described in Japanese Unexamined Patent Application Publication No. 2006-339186, the stray capacitanceThat property of a system of conductors and dielectrics which permits the storage of electricity when potential difference exists between the conductors. Its value is expressed as the ratio of a quantity of electricity to a potential difference. A capacitance value is always positive. may increase, and the circuit characteristics may deviate from a desired value. More specifically, for the wiring substrate described in Japanese Unexamined Patent Application Publication No. 2006-339186, to have a higher wiring densityA figure of merit usually expressed in Joules per cubic inch for capacitors of the wiring patterns in the rigid section than that in the flexible section, a redundant wiring pattern is disposed in the rigid section. The redundant wiring pattern faces other wiring patterns and forms unnecessary stray capacitanceThat property of a system of conductors and dielectrics which permits the storage of electricity when potential difference exists between the conductors. Its value is expressed as the ratio of a quantity of electricity to a potential difference. A capacitance value is always positive.. As a result, the circuit characteristics in the wiring substrate described in Japanese Unexamined Patent Application Publication No. 2006-339186 deviate from a desired value."

Source: http://www.capacitorindustry.com/murata-submits-application-circuit-substrate-and-method-of-manufacturing
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Murata Patent Application, Circuit Substrate Method of Manufacture