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Nanoflex Has Signed an Extension to Its Agreement with The USC

NanoFlex Power Corp of Scottsdale, AZ, USA, which develops photovoltaic technologies and intellectual property, has signed an extension to its agreement with the University of Southern California (USC) and its subcontractor University of Michigan to continue their R&D of thin-film photovoltaic cells - including both gallium arsenide (GaAs) and organic photovoltaics (OPV) technologies - to 2021.

Under the agreements, NanoFlex Power will provide funding for its research partners to optimize the power conversion efficiency of both GaAs and OPV cells, demonstrate low-cost production processes, and improve operating lifetimes. As with prior agreements, all IP derived from the research program will be licensed exclusively to NanoFlex Power.

“We are pleased to continue our long-standing collaborative relationships with USC and the University of Michigan. Their research efforts have resulted in over 750 issued or pending patents worldwide,” says NanoFlex Power’s president & chief operating officer Robert Fasnacht. “With this new agreement, we ensure that they will be our primary research partners for the critical development and commercialization phases for both our GaAs and OPV technologies,” he adds.

“This long-term commitment from NanoFlex Power will accelerate our development of thin-film photovoltaic materials and technologies,” comments Dr Mark Thompson, Professor of Chemistry, Materials Science and Chemical Engineering at USC. “This extension will enable us to rapidly advance our efforts in achieving technical and performance goals for power conversion efficiency, reliability, form factor, and cost,” he adds.

“We are at a critical point in the development of OPV and GaAs technologies,” believes Dr Stephen Forrest, the Paul G. Goebel Professor of Engineering in the Departments of Electrical Engineering and Physics at the University of Michigan. “Our partnership with NanoFlex will position us to achieve key steps critical for the commercialization and market acceptance of these technologies.”

Source: http://www.semiconductor-today.com/news_items/2014/NOV/NANOFLEX_211114.shtml
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Nanoflex Extends Research Agreement with Universities of Southern California and Michigan