Trade Resources Industry Views Suss Microtec and Georgia Tech Conducted Research on Semiconductor 3D Packaging

Suss Microtec and Georgia Tech Conducted Research on Semiconductor 3D Packaging

Germany-based semiconductor equipment firm Suss MicroTec and Georgia Institute of Technology (Georgia Tech) have joined hands for conducting research on nanotechnology, bio-medical and semiconductor 3D packaging.

Under the arrangement, a Suss MicroTec Mask Aligner will be included to the cluster of Suss MicroTec in the cleanrooms of Institute for Electronics and Nanotechnology (IEN) at Georgia Tech.

The cleanrooms are currently utilized for conducting bio-medical device and fabrication.

Georgia Tech IEN executive director Dr. Oliver Brand said: "The addition of this new technology will provide needed functionality for our bio-medical and micro-fluidic research by enhancing our soft lithography capabilities with a wide number of related nanotechnology applications.

"IEN is dedicated to providing access to this state-of-the-art facility and technology workshops to outside industrial users. It is also Georgia Tech's vision to train a local workforce for the growing demand in the nanotechnology industry, particularly in the US Southeast region."

Early this year, Suss MicroTec collaborated with Packaging Research Center (PRC) of Georgia Tech, to work on excimer laser ablation systems for drilling non-photosensitive materials.

Packaging Research Center director Professor Rao Tummala said: "Excimer laser ablation provides a simple solution for imaging on non-photosensitive materials without the high cost of conventional photolithography where multiple coating, exposure, developing and etching processes are required.

"We are fortunate to have access to advanced exposure tools like excimer laser ablation systems to demonstrate smaller features such as via drilling down to 1μm."

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Suss Microtec and Georgia Tech Tie up for 3D Packaging Research