Trade Resources Industry Views Qorvo's 802.11ac Wi-Fi Amplifier Technology Chosen for Netgear's New Nighthawk Router

Qorvo's 802.11ac Wi-Fi Amplifier Technology Chosen for Netgear's New Nighthawk Router

Qorvo Inc of Greensboro, NC and Hillsboro, OR, USA, which provides core technologies and RF solutions for mobile, infrastructure and aerospace/defense applications, says that its RFPA5542 5GHz wireless local-area network (WLAN) power amplifier (PA) module has been selected by consumer Wi-Fi router supplier NETGEAR Inc of San Jose, CA, USA for its Nighthawk X8 AC5300 smart WiFi router (R8500).

"The Nighthawk router series provides the best-in-class performance to fuel ever-increasing demands for Wi-Fi speed, coverage and throughput," claims Sandeep Harpalani, NETGEAR's senior director of product marketing. "Qorvo's high-power, high-efficiency Wi-Fi amplifier technology used on Nighthawk X8 helps us deliver the world's fastest wireless home network connection, giving our customers unparalleled wireless coverage and performance for the growing number of connected devices in the home."

The Nighthawk X8 tri-band quad-stream 802.11ac WiFi router, with Qorvo's RFPA5542 PA, enhances throughput for every device in the home. The tri-band technology maximizes the number of multiple input, multiple output (MIMO) streams, and allows for high-definition video streaming, online gaming and roaming with a strong signal anywhere in the home. The Nighthawk enables eight streams of 5GHz Wi-Fi powered by the RFPA5542, providing extended range and maximum throughput for multiple home devices.

Qorvo's 802.11ac Wi-Fi amplifier technology delivers "unparalleled speed and simultaneous coverage for multiple devices, paving the way for the Internet of Things (IoT) within the home," claims James Klein, Qorvo's president of Infrastructure and Defense products. 

Qorvo says that, for the latest 4x4 and tri-band chipset solutions, the RFPA5542 PA provides power-added efficiency (PAE) of 17% for 802.11ac speeds and over 20% for 802.11n speeds. Moreover, available in 4mm x 4mm standard QFN packaging, the integrated module eliminates the need for external components, greatly reducing system design complexity, layout area, bill of materials, and manufacturing cost for the customer application.

Source: http://www.semiconductor-today.com/news_items/2015/nov/qorvo2_181115.shtml
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