Applications of lead, mercury, cadmium and hexavalent chromium, which are
exempted from the requirements of Article 4(1)
1. Mercury in compact fluorescent lamps not exceeding 5 mg per lamp.
2. Mercury in straight fluorescent lamps for general purposes not exceeding:
�� halophosphate 10 mg
�� triphosphate with normal lifetime 5 mg
�� triphosphate with long lifetime 8 mg.
3. Mercury in straight fluorescent lamps for special purposes.
4. Mercury in other lamps not specifically mentioned in this Annex.
5. Lead in glass of cathode ray tubes, electronic components and fluorescent tubes
6. Lead as an alloying element in steel containing up to 0,35 % lead by weight,
aluminium containing up to 0,4 % lead
by weight and as a copper alloy containing up to 4 % lead by weight.
7. �� Lead in high melting temperature type solders (i.e. tin-lead solder alloys containing more than 85 % lead),
�� lead in solders for servers, storage and storage array systems (exemption granted
until 2010),
�� lead in solders for network infrastructure equipment for switching, signalling,
transmission as well as network
management for telecommunication,
�� lead in electronic ceramic parts (e.g. piezoelectronic devices).
8. Cadmium plating except for applications banned under Directive 91/338/EEC (1)
amending Directive 76/769/EEC (2)
relating to restrictions on the marketing and use of certain dangerous substances
and preparations.
9. Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators.
10. Within the procedure referred to in Article 7(2), the Commission shall evaluate the applications for:
�� Deca BDE,
�� mercury in straight fluorescent lamps for special purposes,
�� lead in solders for servers, storage and storage array systems, network
infrastructure equipment for switching,
signalling, transmission as well as network management for telecommunications
(with a view to setting a
specific time limit for this exemption), and
�� light bulbs,
as a matter of priority in order to establish as soon as possible whether these items
are to be amended accordingly.
The second group has confirmed that the exemption was published in October 15, 2005 Official journal
The Annex to Directive 2002/95/EC is amended as follows:
1. The title is replaced by the following:
��Applications of lead, mercury, cadmium, hexavalent chromium, polybrominated
biphenyls (PBB) or polybrominated diphenyl ethers (PBDE) which are exempted
from the requirements of Article 4(1)��;
2. The following point 9a is added:
��9a. DecaBDE in polymeric applications;��
3. The following point 9b is added:
��9b. Lead in lead-bronze bearing shells and bushes��.
Has confirmed that the third exemption, published in the October 25, 2005 Official journal
1. point 7 is replaced by the following:
7. �� Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead),
�� lead in solders for servers, storage and storage array systems, network
infrastructure equipment for switching,
signalling, transmission as well as network management for telecommunications,
�� lead in electronic ceramic parts (e.g. piezoelectronic devices).
2. point 8 is replaced by the following:
8. Cadmium and its compounds in electrical contacts and cadmium plating except
for applications banned under Directive 91/338/EEC (*) amending Directive 76/769/
EEC (**) relating to restrictions on the marketing and use ofcertain dangerous
substances and preparations.
3. the following points are added:
(11). Lead used in compliant pin connector systems.
(12). Lead as a coating material for the thermal conduction module c-ring.
(13). Lead and cadmium in optical and filter glass.
(14). Lead in solders consisting of more than two elements for the connection
between the pins and the package of microprocessors with a lead content of more
than 80 % and less than 85 % by weight.
(15). Lead in solders to complete a viable electrical connection between
semiconductor die and carrier within integrated circuit Flip Chip packages.��
RoHS: further exemption in December 2004 to submit the relevant consultation ended on February 11 (under consideration):
A further 22 proposed exemptions are under a Commission consultation, which
closes on 11 February 2005:
1��Lead in tin whisker resistant coatings for fine pitch (��0.65 mm) applications (e.g.
connectors).
2��Lead bound in glass, crystal glass, lead crystal or full lead crystal in general.
3��Chromium (VI) and cadmium as colouring agents (up to 2 % content) in glass,
crystal glass, lead crystal or full lead crystal for decorative and/or functional use.
4��Solders containing lead and/or cadmium for specific applications.
5��Hexavalent chromium anti-corrosion coatings.
6��Lead oxide glass in plasma display panels.
7��Lead in connectors, flexible printed circuits, flexible flat cables.
8��Lead glass used for magnetic heads (e.g. VCRs).
9��Cadmium as a doping material in avalanche photodiodes (APDs) for optical fibre
communications.
10��Lead in optical isolators.
11��Lead glass seals in the sheath heater of microwaves.
12��Cadmium pigments (except for those banned by the Cadmium Directive 91/338/
EEC.
13Lead halide (iodide) as a radiant agent in high intensity discharge (HID) lamps
for professional UV applications (e.g. lamps used for curing, reprography and label
printing).
14Lead activators in the phosphors used for specialised straight and compact
fluorescent lamps (e.g. lamps for sun tanning, diazo-printing, reprography, lithography, insect traps).
15��Lead as an amalgam in discharge lamps (e.g. small compact energy-saving fluorescent lamps).
16��Lead in glass solder used for mercury-free flat panel lamps.
17��Lead in the glass envelope of Black Light Blue (BLB) UV lamps (BLB lamps are used
for money checking, leak detection, disco lighting etc).
18��Lead in low melting point alloys (e.g. second soldering operations on a printed
circuit board (PCB) and safety and other temperature dependant switching devices.
19Lead in galvanised steel (up to 0.35% lead) and aluminium (up to 0.4 %
unintended lead).
20Lead in solder and hexavalent chromium in surface treatments in parts
recovered from nonhousehold printers & copying equipment which were originally
placed on the market before 1 July 2006, and are reused as part of the original
equipment manufacturer��s closed loop system until 1 July 2011.
21��Cadmium sulphide photocells.
22��Light sensors which mimic the human eye, such as daylight-responsive dimming systems for lighting.
23��Aeronautic and aerospace sector applications that require high safety standards
for any of the RoHS restricted substances. (Clarifying that EEE in these sectors is
exempt from the RoHS Directive. Such EEE is excluded from the WEEE by falling
outside the 10 WEEE categories.)
RoHS: further exemption (under consideration):
1 Linear incandescent lamp.
2 Mercury in switches.
3 Special ICs having tin-lead solder plating on leads used in professional equipment.
4 Specific modular units including tin-lead solder being used in special professional equipment.
5 Solders containing lead and /or cadmium for specific applications where local
temperature is higher than 150 deg C and which need to work properly more than
500 hours.
6 Lead in solder for printed circuit boards for emergency lighting products.
7 Hexavalent chromium (Cr-VI) in chromate conversion coatings as surface treatment.
8 Lead in gas sensors.
9 Concerning of PbO (Lead in Seal Frit) used for making BLU (Back Light Unit) lamps
in LCD TVs.
10 Cadmium in opto-electronic components.
11 Non-consumer mechanical power transmission systems including speed reducers and
mechanical couplings which rely on electrical/electronic components for safe control
and operation.
12 Electrical and electronic components contained in heating ventilating and air
conditioning building systems, commercial refrigeration systems and transport
refrigeration systems.
13 Cadmium-bearing copper alloys.
14 Electrical/electronic components contained mobile and stationary air
compressors and vacuum systems, compressed air contaminant removal systems
and pneumatic contractor��s air tools.
15 Electrical/electronic equipment that are: used in transport -aviation, aerospace, road, maritime, rail; installed in to the fabric of buildings �C elevators, escalators, moving walks, dumb waiters, and heating, cooling and
ventilation systems, and fire and security systems; used in the energy generation
and transmission; used in mining and mineral processing; used for non-consumer mechanical power transmission systems; industrial process pumps and
compressors; used in industrial refrigeration; and used in military applications.
16 Lead alloys as electrical/mechanical solder for transducers used in high-powered professional and
commercial loudspeakers.
17 Cadmium oxide.
18 Solder tin of the thermo fuse with a defined low melting point.
19 Lead in lead oxide glass used in plasma display panel (PDP).
20 Lead in solder on small PCB and tinned legs of primary components.
21 Use of the not lead free component NEC V25 in the Memor 2000.
22 Lead used in shielding of radiation for Non Medical X-ray equipment.
23 Lead based solders sealed or captured within heat-shrinkable components and devices.
