With silicon-on-insulator (SOI) business declining, 3D TSV stack implementation beginning, and the competitive environment changing, market research firm Yole Développement has released a new study 'Permanent Wafer Bonding for ...
Tags: Electrical, Electronics
The tool is designed for high volume manufacturing and can be used for exposing wafers with a diameter of up to 200 mm. This latest generation tool is a further development of the very successful MA200 Compact platform, of which the 100th ...
Tags: Components, Tools, Hardware
Europe has become an area where special IC´s and electronic applications are being developed and produced, such as Sensors, MEMS, vision applications, specific IC’s, etcetera, in particular for semiconductor, automotive and ...
Tags: special IC´s, electronic applications, TOWA Europe GmbH
A mature LED market has seen a surge in demands this year. Upstream die manufacturers one by one are transforming their market strategies in response to continual decrease in prices. Chinese manufacturer Hong Hai has been dropping prices ...
Tags: LED Market, Lighting
Nordson Asymtek, a Nordson company, has announced the launch of its new Spectrum S-820-C stainless steel dispensing system Class 100 cleanroom use. According to the company, the system can be used in applications that are sensitive to ...
Tags: Nordson Asymtek, Stainless Steel
Rudolph Technologies, Inc., a provider of process characterization, photolithography equipment and software for the semiconductor, FPD, LED and solar industries, today released three new application-specific configurations of its ...
Soraa has recently released the first GaN on GaN LED in a 50W halogen equivalent MR16 lamp with several new features.This LED has a gallium nitride substrate, triangular shaped chip, simplified epitaxial structure and an original ...
Back-end segment and the wafer-level packaging (WLP)-related segments ruled the semiconductor market during the year Global semiconductor capex on manufacturing equipment declined 16.1% during 2012 to $37.8bn compared to 2011, according ...
EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography equipment for the MEMS (micro-electro-mechanical system), nanotechnology and semiconductor markets, says that it is developing equipment and process ...
For full-year 2012, RF RF front-end component maker and foundry services provider TriQuint Semiconductor Inc of Hillsboro, OR, USA has reported revenue of $829.2m, down 7% on 2011’s $896.1m due mainly to a decrease in Mobile Devices ...
Tags: TriQuint, Semiconductor, mobile technologies marketplace
With the LED TV backlight market slowing, and the general lighting market yet to take off, LED makers are looking to all sorts of innovative ways to improve cost and performance to drive adoption — from disruptive new technologies to ...
Tags: LED Market, LED lighting
It was just a few days ago when Japan-based LED maker, Toyota Gosei Co., Ltd., announced its plan to manufacture new LED products using gallium nitride substrates as base components. Measuring up to several hundred µms in thickness, ...
ULIS to triple IR sensor capacity 11 Jul 2012 Investment of €20 million and move to 200mm wafers as the firm marks its tenth anniversary. ULIS 200mm CMOS wafer ULIS,the France-based manufacturer of uncooled infrared sensors for ...
Tags: ULIS, wafer, silicon CMOS process, infrared sensors
A new report estimates that the compound annual growth rate (CAGR) of polymer usage will increase by 26% in wafer level applications over the next 5 years. Last year, polymeric semiconductor material market was valued at $274 million, ...
Tags: Polymeric Materials, Polymer
The manufacturing conference at Strategies in Light focused on methods for reducing cost through the manufacturing supply chain. Yesterday kicked off the manufacturing conference portion of Strategies in Light. Presenters discussed various ...
Tags: Market View, led