DS Smith Plastics is set to open a new rigid packaging manufacturing facility in Romeoville, Illinois, US. The company intends to start production at the new rigid packaging facility in the last quarter of this year. DS Smith will use ...
Tags: Smith Plastics, Rigid Packaging
Rudolph Technologies will launch its new Truebump technology on the Dragonfly inspection system at SEMICON Taiwan, which is due to be held from 13 to 15 September 2017. The new Truebump technology delivers quick, accurate and repeatable ...
Tags: Rudolph, Semicon Taiwan 2017
Evatec Ltd of Trübbach, Switzerland (which makes thin-film deposition and etch processing equipment for advanced packaging, power device, MEMS, optoelectronics, wireless communication and photonics applications) is setting up its own ...
Tags: Evatec, advanced packaging
Smurfit Kappa is set to exhibit its complete Bag-in-Box packaging solutions at this year’s Pack expo event in Las Vegas, US. The event will take place from 25 to 27 September at the Las Vegas Convention Centre. Pack expo Las Vegas ...
Tags: Smurfit Kappa, packaging
SPTS Technologies Ltd of Newport, Wales, UK (an Orbotech company that manufactures etch, PVD and CVD wafer processing solutions for the MEMS, advanced packaging, LED, high-speed RF on GaAs, and power management device markets) has won a ...
For second-quarter 2017, epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA has reported revenue of $115.1m, up 22% on $94.4m last quarter and up 53% on $75.3m a year ago. However, this includes ...
Food processing and packaging solutions provider tna is set to exhibit its ultra-high speed case packer, ropac 5, at this year’s pack expo event in Las Vegas, US. The event will take place from 25 to 27 September. At the event, ...
Tresu Group is set to showcase its advanced packaging and printing solutions at this year’s PRINT event in the US. The event will take place from 10 to 14 September in Chicago. At the event, the company will exhibit ancillary ...
Tags: Tresu Group, Packaging
Compac, a member of the TOMRA Group, has partnered with Xact, a UK-based provider of specialist packaging and marking equipment for the fresh produce industry. The partnership will combine Compac’s Spectrim grading technology with ...
Semiconductor packaging and electronic assembly solutions provider Kulicke & Soffa (K&S) has expanded its advanced packaging presence with the acquisition of privately held Dutch packaging company Liteq. Financial terms of the acquisition ...
Tags: Semiconductor packaging, packaging
Kulicke & Soffa said it will participate at SEMICON West trade show, which is being held in San Francisco, California. The company will give a video illustration of its lithography solution, developed for advanced packaging at the trade ...
Tags: SEMICON West, EV
Filling and packaging technologies manufacturer Krones is set to showcase its packaging solutions at this year’s drinktec event in Germany. The event will take place from 11 to 15 September in Munich. At the event, the firm will ...
Siemens business unit Mentor has introduced a new solution for the design and verification of the existing IC package designs. The Mentor Xpedition High-Density Advanced Packaging (HDAP) flow solution can be used for rapid prototyping ...
Tags: Siemens, Packaging Flow
Mondi is set to showcase a range of advanced packaging solutions at the RosUpack 2017 event in Russia. The event will take place from 20 to 23 June in Moscow. At the event, the firm will exhibit various packaging solutions, including ...
Tags: Mondi, Packaging Solutions
Siemens subsidiary Mentor Graphics is set to exhibit its Valor suite of software and hardware internet of things (IoT) technologies at the SMT Hybrid Packaging event in Germany. The event will take place from 16 to 18 May in Nuremberg. ...
Tags: Hybrid Packaging, Packaging, Siemens