Flexible liquid packaging solutions provider Liqui-Box has signed an agreement to acquire both the engineering and flexible operations of South Africa-based Maverick for undisclosed amount. Liqui-Box is a portfolio company of private ...
Tags: Liqui-Box, Flexible Operations
Leveraging the convergence between its packaging and security printing activities, Agfa positions itself as a strategic partner for advanced packaging applications. It sees the Touchpoint Packaging as a suitable platform for a dialog with ...
Tags: Touchpoint Packaging, packaging
Flexible liquid packaging solutions provider Liqui-Box is planning to invest $4m in advanced packaging production technology at two packaging manufacturing facilities in the US. The firm will upgrade each of the two facilities located at ...
Packaging manufacturer Parkside has unveiled a protective packaging solution, Rockpocket, designed for the transport of high value, delicate items in a compact format. Developed by the Advanced Packaging Expert (APEX) innovation team ...
Fabless high-temperature and and extended-lifetime semiconductor firm CISSOID of Mont-Saint-Guibert, Belgium has delivered the first prototypes of a three-phase 1200V/100A silicon carbide (SiC) MOSFET intelligent power module (IPM) to ...
Kulicke & Soffa Industries has launched new FCC Hub Blades, extending the successful AccuPlus series. The new FCC Hub Blades offer a customizable solution for flip chip, wafer level packaging (WLP) and thick wafer dicing with improved ...
SPTS Technologies Ltd of Newport, Wales, UK (an Orbotech company that manufactures etch, PVD and CVD wafer processing solutions for the MEMS, advanced packaging, LED, high-speed RF on GaAs, and power management device markets) has been ...
Tags: SPTS, ESTnet Awards
Epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA has received multiple orders from a leading foundry in Asia for its Precision Surface Processing (PSP) WaferStorm system (a platform that provides ...
Tags: Veeco Wet processing, Veeco Instruments Inc, Electronics
Veeco Instruments has received multiple orders from a leading foundry in Asia for its Precision Surface Processing (PSP) WaferStorm system. The WaferStorm platform provides wafer processing solutions for advanced packaging applications. ...
Tags: Veeco Instruments, Fan-out Wafer Level Packaging, Packaging
Leading global fresh food packaging supplier, Linpac and new partner Zultec Group joined forces at Gulfood Manufacturing to demonstrate their strengthened capabilities to customers across the Middle East. It was the first time the two ...
Plasma process equipment maker Plasma-Therm LLC of St Petersburg, FL, USA has acquired a High Density Radical Flux plasma technology that enables low-temperature Bosch polymer removal. High Density Radical Flux (HDRF) was developed by ...
Tags: Plasma-Therm, plasma technology, HDRF
For third-quarter 2015, epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA has reported revenue of $140.7m, up 51% on $93.3m a year ago although up only 7% on $131.4m last quarter (which was the ...
Tags: LED market, LCD TVs
Ultratech, a supplier of lithography, laser--processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HBLEDs), as well as atomic layer deposition (ALD) systems, today announced that it has ...
Tags: Wafer-Level Packaging, LEDs
Presto Products Company announced the launch of a new zipper tape to help manufacturers of Individual Quick Frozen (IQF) foods improve line efficiencies. Presto showcased the resealable, press-to-close technology at Pack Expo Las Vegas ...
Tags: Presto, zipper tape, fill machinery, seal machiner
Amcor and Bosch Packaging Technology have partnered to develop ZipSpeed, an optimal material that has been designed to run on Bosch's new SVE 2520DZ vertical Doy Zip bag machine. ZipSpeed has been developed to match the performance of ...
Tags: Amcor, Bosch Packaging, Doy Zip Bagger