The new release will offer customers with thermal flexibility and efficiency for intense gaming, overclocking and case modding
ASUS has launched its ROG Maximus V Formula gaming and overclocking motherboard, Fusion Thermo, which comes with enhanced passive air heat dissipation and liquid cooling readiness.
The company said the new motherboard will offer customers with thermal flexibility and efficiency for intense gaming, overclocking and case modding.
Fusion Thermo sports a hybrid air and water cooling design, embedding an all-copper water channel within the heatsink alongside the heatpipe.
The new motherboard features electroplated barbs at each end to connect to liquid cooling setups, which are made simpler with less hardware modification and faster installs, ASUS said.
Maximus V Formula with Fusion Thermo operates 30% cooler than Swiftech H20-320 Edge water cooling kit and 20% cooler than H30 360 water cooling kit from EKWB.
