Latest Report on Technological Study and Market Research Conducted Has Been Published

The latest report on technological study and market research conducted by Yole Devalopments on Flip Chip has been successfully published. This report contains complete information about flip chip markets, applications of this technnnology, wafer bumping to assembly and the various technologis used in substrates and underfilled materials. A detailed analysis of the cost, supply, value chain and the market has also been conducted and reported. By the end of the year 2010, flip chip packages constituted 13% of all the IC packages and was worth more than 29% of the Global IC market. Though it is the first ever eport by Yole Developments, it tells us a great deal about the dynamic market and how this technology grew from zero to a $16 billion market at the end of 2010. At first it seems like a large market, but the experts at Yole say that it is in th beginning stage with major advancements in applications waiting ahead in the future. Project Manager at Yole Développement Christophe Zinck, says that the factors such as increasing demand of thin devices, increase in the cost of gold used for wire bonding, higher current and temperatures, continued downscaaling of CMOS have encouraged the use of Flip Chips over time. These factors get further strengthened by the fact that more and more sophisticated devices nowadays can not run on wire bonding alongwith weight reductions and higher electrical requirements of the new technologies being put into those devices. Apart from this, the greater than ever demand of the IO density which necessiates the development of new substrate technologies. Failure in resolving these issues will generate bottlenecks and hurdles for the continued application of the Moore’s Law. The report elluminates the changing trends and major transformation in the technology and supply chains as well as the impact of flip chips on the semiconductor sector for the next 5 years. Limited word can be misleading about the dynamics and charecterstics of the flip chip market as the technology itself is too diverse and the applications too varied. Source: packagingmachinerynews.com