TeraXion Inc of Quebec City, Canada (which designs and manufactures optoelectronic components and modules for high-speed fiber-optic transmission networks as well as fiber lasers and optical sensing applications) says that access to cost-effective 400Gb/s systems is now possible with its indium phosphide (InP)-based modulators.
Next-generation single-wavelength transmission systems beyond 100Gb/s bring complex challenges that require high modulation performance, power efficiency and small dimensions, says the firm. Modulators with low drive voltages are consequently necessary to minimize the power dissipation of high-port-density systems. In addition, a high modulation bandwidth increases spectral efficiency by enabling higher symbol rate applications necessary for 200Gb/s, 400Gb/s and beyond. Small-footprint characteristics are equally imperative to enable compact transceiver modules.
"Our commercially available indium phosphide modulators are ready to meet system requirements for 100Gb/s and upcoming advanced modulation formats," says Ian Woods, VP of high-speed photonic components. "This accessibility comes directly from our modulators' capability of reaching higher bandwidths up to 40GHz while being small and Vpi efficient," he declares. "Our modulators indeed offer unique low Vpi drive voltage down to 1.5V," Woods adds. "TeraXion has been sampling 400Gb/s-ready IQ modulators since the beginning of this year and customers are actively advising us that their general performance is superior to lithium niobate modulators, particularly at higher symbol rates."
TeraXion says that the high bandwidth response of its InP-based modulators can enable increased spectral efficiency and reach. In collaboration with academic and industry partners, single-wavelength 400Gb/s system performance has been demonstrated, so far only possible using a TeraXion InP DP-IQM package that exhibits a bandwidth greater than 35GHz.
"Our work with these partners demonstrates the clear benefits of using high-bandwidth modulators for single-carrier 400Gb/s applications and supports TeraXion's leading role in making these future enabling technologies accessible," says Woods. TeraXion's chip-on-carriers are also available for co-packaging with laser, drivers or receivers.
