UK-based etch, deposition and growth system maker Oxford Instruments Plasma Technology (OIPT), part of Oxford Instruments plc, has introduced the PlasmaPro100 Sapphire single wafer etch system.
"The PlasmaPro100 Sapphire is designed specifically to address the harsh chemistries required for HBLED materials, delivering fast etch rates uniformly on wafers up to 200mm in diameter. At Oxford Instruments we strive to provide the most innovative, cost effective and reliable process solutions for our customers. This latest system is designed to encompass all these requirements," said Michelle Bourke, Production Business Group director at Oxford Instruments.
Key system features and benefits include: Electrostatic Clamp technology capable of clamping sapphire, GaN-on-sapphire and silicon; a high power ICP source producing a high density plasma; magnetic spacer for enhanced ion control; and a high conductance pumping system delivering maximum gas throughput at low pressures.
