UK-based plasma etch and deposition processing system maker Oxford Instruments Plasma Technology (OIPT) recently won an order from The City University of New York (CUNY) for its PlasmaPro etch and deposition systems. The PlasmaPro 100 ICP and PECVD systems, and PlasmaPro 80 RIE tool will offer an extensive range of process capability for this new facility, which is being developed for the colleges of The City University of New York.
“The CUNY Advanced Science Research Center (ASRC) will bring the university to a landmark moment in its decade-long, multi-billion-dollar commitment to becoming a national leader in visionary scientific research of vital, real-world consequence,” says vice-chancellor for research Gillian Small. “The ASRC and its core facilities, including the nanofabrication facility, expand on the research capabilities of CUNY and New York City,” she adds.
“Receiving a multiple system order from the USA’s leading urban public university is great news for us, as we are committed to providing leading-edge flexible solutions with the very latest technology available to us,” says OIPT’s sales & marketing director David Haynes. “Our PlasmaPro etch and deposition tools will be housed in the cleanroom that researchers throughout CUNY will use for nanofabrication,” he adds. “The systems will allow a very wide range of research to be undertaken.”
CUNY’s new Advanced Science Research Center houses 200,000 square feet of facilities for increasingly inter-related disciplines of applied science, and it will focus CUNY initiatives in five of the most energized areas of global research: nanoscience, photonics, structural biology, neuroscience, and environmental sciences.
